1
David Sherrer
Matthew L Moynihan, Bruno M Sicard, Carl J Colangelo, John P Cahalen, Brian D Amos, Kevin S Horgan, John J Fisher, David W Sherrer: Optical interface assembly and method of formation. Rohm and Haas Electronics Materials, Jonathan D Baskin, November 6, 2007: US07292756 (12 worldwide citation)

Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is c ...


2
David Sherrer
Matthew L Moynihan, Bruno M Sicard, Carl J Colangelo, John P Cahalen, Brian D Amos, Kevin S Horgan, John J Fisher, David W Sherrer: Optical interface assembly and method of formation. Edwards & Angell, July 28, 2005: US20050163431-A1

Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is c ...


3
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Robert L Goldberg, May 6, 1997: US05626736 (13 worldwide citation)

A process for electroplating a metal clad substrate by forming a sacrificial coating over the metal cladding and then coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is contacted with ...


4
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Robert L Goldberg, April 14, 1998: US05738776 (6 worldwide citation)

A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut ...


5
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Robert L Goldberg, Peter F Corless, Darryl P Frickey, January 12, 1999: US05858198 (4 worldwide citation)

A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut ...


6
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Robert L Goldberg, March 18, 1997: US05611905 (1 worldwide citation)

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the ...


7
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards & Angell, May 15, 2001: US06231619 (1 worldwide citation)

A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then dried by passing the substrates between opposing resilient rollers and preferably passed an air knife.


8
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Robert L Goldberg, April 8, 1997: US05618400 (1 worldwide citation)

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stabili ...


9
Steven M Florio, Jeffrey P Burress, Carl J Colangelo, Edward C Couble, Mark J Kapeckas: Electroplating process. Shipley Company L L C, Robert L Goldberg, November 4, 1997: US05683565 (1 worldwide citation)

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the ...


10
Gary Hamm, David L Jacques, Carl J Colangelo: Method of inhibiting background plating. Rohm and Haas Electronic Materials, John J Piskorski, May 10, 2011: US07939438

Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed.



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