1
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann: High performance integrated circuit packaging structure. International Business Machines Corporation, Steven J Meyers, Aziz M Ahsan, March 7, 1989: US04811082 (428 worldwide citation)

A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the co ...


2
Scott L Jacobs, Maurice T McMahon Jr, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann, Arthur R Zingher: Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure. International Business Machines Corporation, Steven J Meyers, Yen S Yee, March 28, 1989: US04817093 (101 worldwide citation)

A self-contained method and structure for partitioning, testing and diagnosing a multi-chip packaging structure. The method comprises the steps of electronically inhibiting all chips in the multi-chip package except for the chip or chips under test, creating a signature of the chip or chips under te ...


3
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann, Arthur R Zingher: Module for packaging semiconductor integrated circuit chips on a base substrate. International Business Machines Corporation, Aziz M Ahsan, Steven J Meyers, September 12, 1989: US04866507 (85 worldwide citation)

An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i.e., silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i.e., thin film copper of app ...


4
Burhan Ozmat, Mustansir Hussainy Kheraluwala, Eladio Clemente Delgado, Charles Steven Korman, Paul Alan McConnelee: Power electronic module packaging. General Electric Company, Jill M Breedlove, Christian G Cabou, April 23, 2002: US06377461 (71 worldwide citation)

A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure i ...


5
Burhan Ozmat, Mustansir Hussainy Kheraluwala, Eladio Clemente Delgado, Charles Steven Korman, Paul Alan McConnelee: Power electronic module packaging. General Electric Company, Jill M Breedlove, Douglas E Stoner, May 15, 2001: US06232151 (41 worldwide citation)

A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure i ...


6
Burhan Ozmat: Heat transfer module for ultra high density and silicon on silicon packaging applications. Texas Instruments Incorporated, Rene E Grossman, Richard L Donaldson, March 28, 1995: US05402004 (38 worldwide citation)

A system for dissipating heat from semiconductor chips disposed on a substrate which may individually produce differing amounts of heat, the substrate secured to a device uniformly distributing the heat produced by the chips thereover in the form of a metal matrix composite of a thermally conductive ...


7
Burhan Ozmat: High performance heat exchanger and method. Intersil Americas, Carter Ledyard & Milburn, March 6, 2001: US06196307 (35 worldwide citation)

A heat exchanger and method for cooling power electronics modules. The power electronics module transferring heat generated during operation to the heat exchanger through a thermal base of the power module. The heat exchanger being directly bonded to the thermal base and comprising a metal foam. The ...


8
Robert J Gordon, Brian J Love, Robert K Peterson, Burhan Ozmat: Ceramic based substrate for electronic circuit system modules. Texas Instruments Incorporated, Rene E Grossman, Melvin Sharp, July 24, 1990: US04943468 (16 worldwide citation)

An electronic system having a first printed wiring board, a first integrated circuit carrier positionable on the printed wiring board and a substrate having a central portion formed of ceramic material. The substrate central portion has a specific thermal conductivity greater than 1.5.times.10.sup.- ...


9
Burhan Ozmat, Robert J Gordon: Constraining core for surface mount technology. Texas Instruments Incorporated, Richard L Donaldson, Rene E Grossman, March 16, 1993: US05195021 (14 worldwide citation)

A thermal core (10) comprising a graphite layer (12) held between two molybdenum layers (14) for dissipating heat from a plurality of chip carriers 22. Core 10 has the ability to withstand excessive vibrational loads while being light weight. Bonding molybdenum/graphite/molybdenum layers (12, 14) cr ...


10
Burhan Ozmat: Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam therein. Intersil Americas, Duane Morris, June 4, 2002: US06397450 (14 worldwide citation)

A heat exchanger and method for cooling power electronics modules. The power electronics module transferring heat generated during operation to the heat exchanger through a thermal base of the power module. The heat exchanger being directly bonded to the thermal base and comprising a metal foam. The ...