1
John Xidos, Ross MacDougall, David Carrigan, Gary Hammond, Pamela Little, Bruce Reid: Distributed gaming system. Tech Link International Entertainment, Roylance Abrams Berdo & Goodman, December 22, 1998: US05851149 (811 worldwide citation)

The Distributed Gaming System provides a user with remote location gaming, for example from within a hotel room. Using the room's television and a remote control, the user, such as a hotel guest, is able to play games similar to those available on a Video Lottery Terminal. The games are displayed on ...


2
Son Ky Quan, Samuel L Coffman, Bruce Reid, Keith E Nelson, Deborah A Hagen: Semiconductor package and method thereof. Motorola, Robert F Hightower, July 7, 1998: US05776798 (259 worldwide citation)

A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing ...


3
David S Hunt, W Bruce Reid: Spring-bag printer ink cartridge with volume indicator. Hewlett Packard Company, October 25, 1994: US05359353 (65 worldwide citation)

An ink jet pen supply cartridge having a spring biased ink bag with a visual indication of remaining ink quantity. The spring-bag reservoir tends to collapse laterally as the ink supply decreases due to differential pressure exerted thereto. The spring-bag is contained in a rigid cartridge and a pai ...


4
W Bruce Reid, Mindy A Hamlin, Arthur K Wilson: Reliable contact pad arrangement on plastic print cartridge. Hewlett Packard Company, January 6, 1998: US05706040 (39 worldwide citation)

The contact pads of a print cartridge are formed on a flexible tape. Each of the uniformly spaced contact pads is preferably a square separated from an adjacent square by a minimum distance to provide each contact pad with a maximum area. The contact pads are arranged on the flexible tape only along ...


5
Son Ky Quan, Samuel L Coffman, Bruce Reid, Keith E Nelson, Deborah A Hagen: Semiconductor package and method therefor. Freescale Semiconductor, April 19, 2011: US07927927 (33 worldwide citation)

A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the ...


6
W Bruce Reid, Mindy A Hamlin, Arthur K Wilson, Donald G Harris, Majid Azmoon: Reliable contact pad arrangement on plastic print cartridge. Hewlett Packard Company, January 16, 2001: US06174046 (14 worldwide citation)

The contact pads of a print cartridge are formed on a flexible tape. Each of the uniformly spaced contact pads is preferably a square separated from an adjacent square by a minimum distance to provide each contact pad with a maximum area. Conductive traces run along the flexible tape and between the ...


7
Brian J Keefe, Winthrop D Childers, Steven W Steinfield, W Bruce Reid: Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof. Hewlett Packard Company, David S Romney, October 22, 1996: US05568171 (12 worldwide citation)

An inkjet printhead includes a compact substrate having transmission circuitry such as actuation signal lines and address circuitry and ground lines in connection with resistors in a plurality of vaporization chambers on the substrate, with a minimal number of interconnect junctions located at both ...


8
W Bruce Reid: Slit nozzle tape for inkjet printhead. Hewlett Packard Company, May 9, 1995: US05414454 (7 worldwide citation)

Slits are cut in a nozzle tape and aligned with encapsulant beads on a printhead. The slits mechanically decouple portions of the tape stuck to the beads from a central portion of the tape stuck to a nozzle plate, and thereby prevent lifting of the tape off the nozzle plate in the event that the tap ...


9
BRUCE Gail, SCHOUTEN Bob A, SCHOUTEN Connie S, VOIGTS David, BRUCE Reid Alan: DISPOSITIF DARRIMAGE POUR TRACTER UNE CHARGE DANS UN VÉHICULE, VEHICLE TIE-DOWN DEVICE FOR HAULING A LOAD. GLOBAL CONSUMER PRODUCTS, BRUCE Gail, SCHOUTEN Bob A, SCHOUTEN Connie S, VOIGTS David, BRUCE Reid Alan, JOHNSON R Brian, November 15, 2012: WO/2012/154273 (1 worldwide citation)

Disclosed are tie-down devices and related methods for securing oversized items in a vehicle trunk or rear storage compartment in preparation for transport. The tie-down devices include sections connected by a releasable buckle that allows for separately cinching the strap sections to desired length ...


10
W Bruce Reid: Tape automated bonding circuit with interior sprocket holes. Hewlett Packard Company, June 16, 1998: US05766983

A process for manufacturing a tape automated bonding circuit with interior sprocket holes including: a substrate; at least one conductor deposited on the substrate; a functional area on the substrate defined by a polygon surrounding the conductor with all sides of the polygon adjacent to a segment o ...



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