1
Bruce C S Chou, Li Kuo Chiu: Electronic identification key with portable application programs and identified by biometrics authentication. Lightuning Tech, Aimgene Technology, Muncy Geissler Olds & Lowe PLLC, November 4, 2008: US07447911 (78 worldwide citation)

An electronic identification key to be connected to a terminal system to execute at least one specific operation. The electronic identification key includes a housing, a standard interface connector, a chip-type fingerprint sensor, an embedded AP (Application Program) memory module and a control mic ...


2
Bruce C S Chou: Sweep-type fingerprint sensor module. Lightuning Tech, Birch Stewart Kolasch & Birch, April 3, 2007: US07200250 (73 worldwide citation)

A sweep-type fingerprint sensor module includes a microprocessor and a sweep-type fingerprint sensor, which includes a substrate, and a sensing members array, a speed-detecting unit, and a processing circuit on the substrate. The array is composed of plural fingerprint sensing members. When the fing ...


3
Bruce C S Chou, Hsien Ming Wu, Ping Chin Sun: Wafer level packaging of micro electromechanical device. Lightuning Tech, Rosenberg Klein & Lee, March 23, 2004: US06710461 (42 worldwide citation)

The present invention provides a wafer level package of micro electromechanical devices. The wafer level package of the present invention comprises a wafer having a plurality of micro electromechanical devices and a package wafer of the same size. A plurality of conductor plugs penetrate through the ...


4
Bruce C S Chou, Ben Chang, Wallace Y W Cheng: Capacitive fingerprint sensor. LighTuning Tech, Birch Stewart Kolasch & Birch, August 29, 2006: US07099497 (33 worldwide citation)

A capacitive fingerprint sensor includes a plurality of capacitive sensing members arranged in a 2D array. A charge-sharing principle is utilized to read signals in the capacitive sensing member. Each capacitive sensing member includes an insulating surface layer, a sense electrode, a reference elec ...


5
Chen Hsun Du, Bruce C S Chou, Chengkuo Lee: Method of fabricating thermoelectric sensor and thermoelectric sensor device. Metrodyne Microsystem, October 9, 2001: US06300554 (22 worldwide citation)

A thermoelectric sensor device is disclosed consisting of polysilicon, titanium or AlSiCu as the thermocouple of material for thermoelectric sensor device. The features of the present process are: Selecting a material such as aluminum, titanium, aluminum alloy or titanium alloy with lower thermal co ...


6
Bruce C S Chou, Mang Ou Yang: Thermopile infrared sensor, thermopile infrared sensors array, and method of manufacturing the same. Bruce C S Chou, Mang Ou Yang, Steve S H Shyu, Metrodyne Microsystem, January 1, 2002: US06335478 (19 worldwide citation)

A thermopile infrared sensor includes a substrate, at least one thermocouple cantilever beam comprising at least one thermocouple, and a suspending membrane. The cantilever beam is formed above the substrate. The cantilever beam has a first end and a second end located away from the first end. The f ...


7
Chang Chia Chang, Chen Chih Fan, Bruce C S Chou: MEMS device structure and methods of forming same. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, September 22, 2015: US09139420 (16 worldwide citation)

A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A seco ...


8
Bruce C S Chou: Thermal bubble type micro inertial sensor. Lightuning Tech, Birch Stewart Kolasch & Birch, July 4, 2006: US07069785 (13 worldwide citation)

A thermal bubble type micro inertial sensor formed by micromachining technology includes a substrate, a heater arranged on the substrate, four temperature sensing members, a cap arranged above the substrate to cover and encapsulate the heater and the temperature sensing members, and a liquid filled ...


9
Bruce C S Chou, Ben S B Chang, Wallace Y W Cheng: Pressure type fingerprint sensor fabrication method. Ligh Tuning Technology, Rosenberg Klein & Lee, July 6, 2004: US06759264 (13 worldwide citation)

The present invention provides a fabrication method of a pressure type fingerprint sensor, which uses the commercial integrated circuit process to form the sensor and the processing circuit together on the same chip. The present invention comprises a plurality of capacitive pressure sensors arranged ...


10
Bruce C S Chou, Chih Hsien Lin, Hsiang Tai Lu, Jung Kuo Tu, Tung Hung Hsieh, Chen Hua Lin, Mingo Liu: Package structure and methods of forming same. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, March 3, 2015: US08970023 (10 worldwide citation)

A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the f ...