1
Brian S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, December 6, 1994: US05371654 (318 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


2
Brian S Beaman, Keith E Fogel, Paul A Lauro, Maurice H Norcott, Da Yuan Shih, George F Walker: Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer. International Business Machines Corporation, Daniel P Morris, June 3, 1997: US05635846 (218 worldwide citation)

A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard pack ...


3
Brian S Beaman: Elastomeric area array interposer. International Business Machines Corporation, Blaney Harper, George E Clark, Maurice H Klitzman, March 12, 1991: US04998885 (172 worldwide citation)

This invention provides an interposer for electrically connecting two substrates with high density interconnections. The interposer comprises an elastomeric material surrounding fine metal wires which extend through the elastomeric material. The elastomeric material provides mechanical support and e ...


4
Brian S Beaman, Keith E Fogel, Jungihl Kim, Wolfgang Mayr, Jane M Shaw, George F Walker: Connector assembly for chip testing. International Business Machines, Perman & Green, December 4, 1990: US04975079 (163 worldwide citation)

An electrical connector is described for making contact with a plurality of convex and deformable contacts on an electronic device. The electrical connector comprises a substrate having a plurality of conductors which extend above its surface. A polymeric material is disposed on the surface of the s ...


5
Juan Ayala Esquilin, Brian S Beaman, Rudolf A Haring, James L Hedrick, Da Yuan Shih, George F Walker: Process of making pinless connector. International Business Machines Corporation, Robert B Martin, August 15, 1995: US05441690 (76 worldwide citation)

The present invention relates to an improved pinless connector for use in microelectronics comprising an improved elastomer resin of polysiloxane and filler.


6
Brian S Beaman, Fuad E Doany, Thomas J Dudek, Alphonso P Lanzetta, Da Yuan Shih, William J Tkazyik, George F Walker: Flex circuit card elastomeric cable connector assembly. International Business Machines Corporation, Lynn L Augspurger, July 18, 1995: US05433631 (48 worldwide citation)

A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex ...


7
Gareth G Hougham, Brian S Beaman, Evan G Colgan, Paul W Coteus, Stefano S Oggioni, Enrique Vargas: Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries. International Business Machines Corporation, Scully Scott Murphy & Presser P C, Daniel P Morris Esq, February 19, 2008: US07331796 (24 worldwide citation)

A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elasto ...


8
Brian S Beaman, Fuad E Doany, Thomas J Dudek, Alphonso P Lanzetta, Da Yuan Shih, William J Tkazyik, George F Walker: Flex circuit card elastomeric cable connector assembly. International Business Machines Corporation, Lynn L Augspurger, January 31, 1995: US05386344 (22 worldwide citation)

A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex ...


9
Gareth G Hougham, Brian S Beaman, Evan G Colgan, Paul W Coteus, Stefano S Oggioni, Enrique Vargas: Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries. International Business Machines Corporation, Scully Scott Murphy & Presser P C, Daniel P Morris Esq, November 16, 2010: US07832095 (14 worldwide citation)

A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted ...


10
Brian S Beaman: Integral elastomeric card edge connector. March 3, 1992: US05092782 (14 worldwide citation)

An integral elastomeric card edge connector provides shorter signal paths through the contact with reduced interference. The card edge contact allows high density interconnection between several layers of multi-layer circuit card without routing signal paths to the card surface. Elastomeric contact ...