1
Brian L Hoekstra, Leonid B Glebov, Oleg M Efimov: Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe. Accudyne Display and Semiconductor Systems, Banner & Witcoff, April 3, 2001: US06211488 (119 worldwide citation)

An apparatus and method for physically separating non-metallic substrates forms a microcrack in the substrate and controllingly propagates the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack inside the ...


2
Brian L Hoekstra, Javier A Pierola, Aravinda Kar: Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator. Accudyne Display and Semiconductor Systems, Banner & Witcoff, June 26, 2001: US06252197 (98 worldwide citation)

An apparatus and method for physically separating non-metallic substrates by forming a microcrack in the substrate and controllingly propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. A scribe beam is applied onto the substrate on a ...


3
Brian L Hoekstra: Method for separating non-metallic substrates. Banner & Witcoff, July 16, 2002: US06420678 (87 worldwide citation)

A method for physically separating non-metallic substrates by forming a microcrack in the substrate and controllingly propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate be ...


4
Brian L Hoekstra: Apparatus for separating non-metallic substrates. Accudyne Display and Semiconductor Systems, Banner & Witcoff, July 10, 2001: US06259058 (73 worldwide citation)

An apparatus for physically separating non-metallic substrates by forming a microcrack in the substrate and controlling propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate ...