1
Bernd Goller: Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component. Infineon Technologies, Edell Shapiro & Finnan, September 14, 2010: US07795717 (77 worldwide citation)

An electronic component has a first semiconductor chip and a second semiconductor chip that is arranged on a plastic compound in which the first semiconductor chip is embedded. The semiconductor chips are connected to one another by rewiring layers and vias which extend between the rewiring layers, ...


2
Manfred Berg, Bernd Goller: Plug-in connector for a pressure pipe system. Armaturenfabrik Hermann Voss & Co, Jones & Askew, October 28, 1997: US05681060 (28 worldwide citation)

A connector having a plug part insertable in a sealing and locking manner into a receiver opening of a socket part. An annular retaining element is preassembled into a ring groove of one of the connector parts, prior to insertion. The retaining element is deformable in a radially elastic manner duri ...


3
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Robert Christian Hagen, Christian Stümpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, March 23, 2004: US06710455 (28 worldwide citation)

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...


4
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic package and method for production. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276783 (26 worldwide citation)

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


5
Bernd Goller, Robert Christian Hagen, Christian Stuempfl, Stefan Wein, Holger Woerner: Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, June 7, 2005: US06902951 (18 worldwide citation)

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semi ...


6
Edward Fuergut, Bernd Goller, Robert Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner: Smart card, smart card module, and a method for production of a smart card module. Infineon Technologies, Edell Shapiro & Finnan, August 18, 2009: US07575173 (17 worldwide citation)

A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surfa ...


7
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Universal package for an electronic component with a semiconductor chip and method for producing the universal package. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Gregory L Mayback, March 15, 2005: US06867471 (16 worldwide citation)

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of ...


8
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner: Electronic component and process for producing the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, January 27, 2004: US06683374 (12 worldwide citation)

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to ...


9
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, April 14, 2009: US07517722 (10 worldwide citation)

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper ...


10
Bernd Goller, Markus Dinkel, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim: Semiconductor package with mold lock vent. Infineon Technologies, Dicke Billig & Czaja PLLC, June 8, 2010: US07732937 (4 worldwide citation)

A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about th ...