1
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


2
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of planarizing tips of probe elements of a probe card assembly. FormFactor, David J Larwood, Gerald E Linden, November 2, 1999: US05974662 (326 worldwide citation)

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the spa ...


3
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu: Fabricating interconnects and tips using sacrificial substrates. FormFactor, Gerald Linden, Daivd Larwood, November 30, 1999: US05994152 (245 worldwide citation)

Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate esta ...


4
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, Gerald E Linden, Fenwick & West, September 15, 1998: US05806181 (235 worldwide citation)

The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated ...


5
Gaetan L Mathieu, Benjamin N Eldridge, Gary W Grube: Lithographic contact elements. FormFactor, Blakely Sokoloff Taylor & Zafman, July 3, 2001: US06255126 (227 worldwide citation)

A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structu ...


6
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of fabricating an interconnection element. David Larwood, January 8, 2002: US06336269 (216 worldwide citation)

Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, genera ...


7
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of mounting resilient contact structures to semiconductor devices. FormFactor, David Larwood, Gerald Linden, November 3, 1998: US05829128 (199 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


8
Benjamin N Eldridge, Igor Y Khandros, Gaetan L Mathieu, David V Pedersen: Method of making microelectronic spring contact elements. FormFactor, Gerald E Linden, David Larwood, February 6, 2001: US06184053 (185 worldwide citation)

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contac ...


9
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of making temporary connections between electronic components. Form Factor, Gerald E Linden, David J Larwood, November 10, 1998: US05832601 (168 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


10
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method. FormFactor, Blakely Sokoloff Taylor & Zafman, August 29, 2000: US06110823 (165 worldwide citation)

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring thw wire into a wire stem having a springable shape, serving thw wire stem, and overcoating the wire stem with at least one layer of a ...