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Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 1, 2001: US06225688 (230 worldwide citation)

A stacked microelectronic assembly and its resulting structure includes a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The assembly includes a plurality of microelectronic ...


2
Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessers, Lerner David Littenberg Krumholz & Mentlik, March 2, 2004: US06699730 (172 worldwide citation)

A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of micro ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, April 23, 2002: US06376904 (139 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor module with imbedded heat spreader. Rambus, Pennie & Edmonds, September 10, 2002: US06449159 (116 worldwide citation)

The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partiall ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Sayeh Khalili, Donald R Mullen, Nader Gamini: Multi-channel memory architecture. Rambus, Lee & Hayes PLLC, February 8, 2005: US06853557 (114 worldwide citation)

A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second substrate containing multiple memory devices and a second channel portion extending across the second subst ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Method of making a connection to a microelectronic element. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2002: US06428328 (109 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Lidless socket and method of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 14, 1999: US05951305 (103 worldwide citation)

A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric elemen ...


8
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 12, 2000: US06117694 (100 worldwide citation)

A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporar ...


9
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Components with conductive solder mask layers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2001: US06329605 (100 worldwide citation)

A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in prox ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Low insertion force connector for microelectronic elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 13, 2001: US06200143 (90 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...



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