1
Bangalore J Shanker, Jagdish G Belani: Use of a heat pipe integrated with the IC package for improving thermal performance. National Semiconductor Corporation, Gail W Woodward, Lee Patch, Michael A Glenn, March 27, 1990: US04912548 (111 worldwide citation)

A CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof. A quantity of working fluid, such as fluorinated octane, is contained within the package cavity. The heat pipe communicates with c ...


2
Bangalore J Shanker, Yida Zou, Sergio Camerlo: Methods and apparatus for cooling a circuit board component using a heat pipe assembly. Cisco Technology, Chapin & Huang L L C, David E Huang Esq, July 5, 2005: US06914780 (38 worldwide citation)

A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the support plane. A heat pipe assemb ...


3
Bangalore J Shanker, Suryaprakash Jonnavithula, Ashwath Nagaraj, Wheling Cheng: Methods and apparatus for testing a circuit board using a surface mountable adaptor. Cisco Technology, Chapin & Huang L L C, David E Huang Esq, June 14, 2005: US06906544 (7 worldwide citation)

A surface mount adaptor allows for removable attachment of debugging connectors to a circuit board and provides high density access to the circuit board under test at a single location. A circuit board testing assembly has a support member having debugging connectors coupled to a first surface of th ...


4
Mohan R Nagar, Kuo Chuan Liu, Mudasir Ahmad, Bangalore J Shanker, Jie Xue: Method and apparatus for supporting a computer chip on a printed circuit board assembly. Cisco Technology, Novak Druce Connolly Bove Quigg, February 24, 2015: US08962388

A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adja ...


5
Mohan R Nagar, Kuo Chuan Liu, Mudasir Ahmad, Bangalore J Shanker, Jie Xue: Method and apparatus for supporting a computer chip on a printed circuit board assembly. Cisco Technology, BainwoodHuang, December 20, 2011: US08081484

A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adja ...


6
Mohan R Nagar, Kuo Chuan Liu, Mudasir Ahmad, Bangalore J Shanker, Jie Xue: Method and apparatus for supporting a computer chip on a printed circuit board assembly. Cisco Technology, Bainwood Huang & Associates, June 5, 2008: US20080130241-A1

A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adja ...


7
Mohan R Nagar, Kuo Chuan Liu, Mudasir Ahmad, Bangalore J Shanker, Jie Xue: Method and apparatus for supporting a computer chip on a printed circuit board assembly. Cisco Technology, May 10, 2012: US20120113608-A1

A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adja ...