1
Ban P Loh, Gerald H Negley: Power light emitting die package with reflecting lens and the method of making the same. Cree, Jenkins Wilson Taylor & Hunt P A, November 25, 2008: US07456499 (104 worldwide citation)

A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the lead ...


2
Peter S Andrews, Ban P Loh: Power surface mount light emitting die package. Cree, Harness Dickey & Pierce, July 17, 2007: US07244965 (103 worldwide citation)

A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the s ...


3
Ban P Loh: Power surface mount light emitting die package. Cree, Harness Dickey & Pierce, September 4, 2007: US07264378 (82 worldwide citation)

A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate is made from thermally conductive but electrically insulating material. The substrate has traces for connecting an external electrical power source to a light emitting diode ...


4
Ban P Loh, Gerald H Negley: Composite optical lens with an integrated reflector. Cree, Jenkins Wilson Taylor & Hunt P A, October 9, 2007: US07280288 (54 worldwide citation)

A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a ...


5
Ban P Loh: LED package die having a small footprint. Silicon Edge Law Group, D James Chung, May 24, 2005: US06897486 (51 worldwide citation)

A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, ...


6
Ban P Loh, Nicholas W Medendorp Jr, Eric Tarsa, Bernd Keller: Leadframe-based packages for solid state light emitting devices. Cree, Myers Bigel Sibley & Sajovec, October 25, 2011: US08044418 (46 worldwide citation)

A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further incl ...


7
Ban P Loh: Composite leadframe LED package and method of making the same. CREE, Jenkins Wilson Taylor & Hunt P A, April 6, 2010: US07692206 (42 worldwide citation)

Light emitting die package is disclosed. The die package includes a leadframe, a bottom heatsink, a top heatsink, a reflector and a lens. The top and bottom heatsinks are thermally coupled but electrically insulated from the leadframe. The leadframe includes a plurality of leads and defines a mounti ...


8
Ban P Loh, Nicholas W Medendorp Jr, Peter Andrews, Yankun Fu, Michael Laughner, Ronan Letoquin: Method of uniform phosphor chip coating and LED package fabricated using method. Cree, Koppel Patrick Heybl & Philpott, May 17, 2011: US07943952 (38 worldwide citation)

Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are al ...


9
Ban P Loh: Power surface mount light emitting die package. Cree, Jenkins Wilson Taylor & Hunt P A, August 17, 2010: US07775685 (37 worldwide citation)

A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pa ...


10
Ban P Loh: Power surface mount light emitting die package. Cree, Jenkins Wilson Taylor & Hunt P A, February 9, 2010: US07659551 (37 worldwide citation)

A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to mov ...