1
Bahgat Sammakia, Wayne E Jones Jr, Ganesh Subbarayan: Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers. The Research Foundation of the State University of New York, Hoffberg & Associates, January 12, 2010: US07645512 (7 worldwide citation)

The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesi ...


2
Hao Howard Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang: Composite thermal interface material system and method using nano-scale components. The Research Foundation of State University of New York, Steven M Hoffberg, Ostrolenk Faber, March 6, 2012: US08129001 (5 worldwide citation)

A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The ...


3
Junghyun Cho, Scott Oliver, Wayne Jones, Bahgat Sammakia: Surface coating for electronic systems. The Research Foundation of State University of New York, Milde & Hoffberg, October 16, 2007: US07282254 (5 worldwide citation)

A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, Si3N4, BN, TiN, SiO2, Al2O3, ZrO2, YSZ, and other ceramic mat ...


4
Bahgat Sammakia, Wayne E Jones Jr, Ganesh Subbarayan: Nano-structure enhancements for anisotropic conductive material and thermal interposers. The Research Foundation of State University of New York, Steven M Hoffberg, Ostrolenk Faber, August 27, 2013: US08518304 (3 worldwide citation)

The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnectio ...


5
Siddharth Bhopte, Bruce Murray, Bahgat Sammakia: Devices and fluid flow methods for improving mixing. The Research Foundation of State University of New York, Medlen & Carroll, October 2, 2012: US08277112 (2 worldwide citation)

The invention provides devices and methods for increasing the degree of mixing of fluids, including under conditions of laminar flow and turbulent flow. In one embodiment, mixing of fluids using the invention's devices and methods is increased by splitting the flow of at least one of the fluids into ...


6
Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang: Composite thermal interface material system and method using nano-scale components. The Research Foundation for The State University of New York, Steven M Hoffberg, Ostrolenk Faber, April 28, 2015: US09017808 (2 worldwide citation)

A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The ...


7
Bahgat Sammakia, Wayne E Jones, Ganesh Subbarayan: Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers. The Research Foundation of State University of New York, Steven M Hoffberg, Ostrolenk Faber, May 8, 2012: US08173260 (1 worldwide citation)

The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesi ...


8
Junghyun Cho, Scott Oliver, Wayne Jones, Bahgat Sammakia: Surface coating for electronic systems. The Research Foundation for The State University of New York, Steven M Hoffberg, Ostrolenk Faber, April 1, 2014: US08685529 (1 worldwide citation)

A method for coating for a substrate, comprising applying an underlayer of a self assembling monolayer well ordered array of long chain molecules on the substrate; and applying a top layer, over the underlayer, wherein the self-assembling monolayer well ordered array serves as a molecular template o ...


9
Junghyun Cho, Bahgat Sammakia, Mark D Poliks, Roy Magnuson, Biplab Kumar Roy: Embedded thin films. The Research Foundation for the State University of New York, Steven M Hoffberg, Tully Rinckey PLLC, August 28, 2018: US10064283

A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the so ...


10
Junghyun Cho, Scott Oliver, Wayne Jones, Bahgat Sammakia: Method of manufacturing surface coatings for electronic systems. The Research Foundation of State, Steven M Hoffberg, Ostrolenk Faber, April 17, 2012: US08158201

A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, Si3N4, BN, TiN, Si02, Al203, Zr02, YSZ, and other ceramic mat ...