1
Joseph Funari, Terence C Godown, Scott D Reynolds, Bahgat G Sammakia: Pluggable electronic circuit package assembly with snap together heat sink housing. International Business Machines Corporation, Norman R Bardales, April 28, 1992: US05109318 (120 worldwide citation)

A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing. The heat sink housing has internal retention posts and internal posts receiving recesses that allow the two pieces to be snap fit together for easy assembly and disassembly. Also, a ...


2
Morris Anschel, Bahgat G Sammakia: Electronic package with heat spreader member. International Business Machines Corporation, Lawrence R Fraley, April 3, 1990: US04914551 (111 worldwide citation)

An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention ...


3
Joseph Funari, Mary C Green, Scott D Reynolds, Bahgat G Sammakia: Electronic package with improved heat sink. International Business Machines, 1701 North Street Endicott NY 13760, July 18, 1989: US04849856 (76 worldwide citation)

An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes plia ...


4
Lawrence S W Mok, Sampath Purushothaman, Bahgat G Sammakia, Janusz S Wilczynski, Tien Y Wu: Electronic package having active means to maintain its operating temperature constant. International Business Machines Corporation, Scully Scott Murphy & Presser, February 13, 1996: US05491610 (69 worldwide citation)

An electronic package having an active cooling system for maintaining a semiconductor chip at approximately a constant temperature by monitoring the present temperature of the chip and varying the air flow over a heat sink in thermal contact with the chip in response to the temperature. In addition, ...


5
Morris Anschel, Anthony P Ingraham, Charles R Lamb, Michael D Lowell, Voya R Markovich, Wolfgang Mayr, Richard G Murphy, Mark V Pierson, Tamar A Powers, Timothy S Reny, Scott D Reynolds, Bahgat G Sammakia, Wayne R Storr: Method and apparatus for testing of integrated circuit chips. International Business Machines Corporation, Richard M Goldman, May 30, 1995: US05420520 (65 worldwide citation)

A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. Th ...


6
Don L Baker, Joseph Funari, William F Otto, Bahgat G Sammakia, Randall J Stutzman: Electronic assembly with enhanced heat sinking. International Business Machines Corporation, Lawrence R Fraley, March 26, 1991: US05003429 (37 worldwide citation)

An electronic package which includes at least two flexible circuitized substrates (e.g., thin film elements) connected at one location to a common first circuitized substrate (e.g., printed circuit board) and at another location to a semiconductor device, these subassemblies being located within a b ...


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8
Bahgat G Sammakia, Sanjeev B Sathe: Method for using pulsating flow to improve thermal transport in systems. International Business Corporation, Lawrence R Fraley, Schmeiser Olsen & Watts, April 17, 2001: US06219234 (4 worldwide citation)

A method for forming a pulsating air pattern at a surface of an electronic carrier assembly. The electronic carrier assembly includes a circuit card having an attached module or chip. An air circulation pattern, or flow pattern, is formed at the surface of an electronic carrier assembly by natural c ...


9
Drew A Davidson, Bahgat G Sammakia: Method and pattern of dispensing thermal interface materials. The Research Foundation of State University of New York, Steven M Hoffberg, Ostrolenk Faber, July 9, 2013: US08481103 (1 worldwide citation)

An interface is formed by pressing a first surface and a second surface together, with a particle-loaded thermal interface material (TIM) in between. By applying the thermal interface material to controlled locations on the first surface in controlled amounts, final layer thickness at a given squeez ...


10
Drew A Davidson, Bahgat G Sammakia: Method and pattern of dispensing thermal interface materials. The Research Foundation for The State University of New York, Steven M Hoffberg, Ostrolenk Faber, October 7, 2014: US08851159

An interface is formed by pressing a first surface and a second surface together, with a particle-loaded thermal interface material (TIM) in between. By applying the thermal interface material to controlled locations on the first surface in controlled amounts, final layer thickness at a given squeez ...