1
Daniel Irwin Amey Jr, Sounak Banerji, William J Borland, Karl Hartmann Dietz, David Ross McGregor, Attiganal N Sreeram: Power core devices. E I du Pont de Nemours and Company, November 3, 2009: US07613007 (26 worldwide citation)

The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a ...


2
Attiganal N Sreeram, Brian Lewis, Leszek Hozer, Michael James Liberatore, Gerard Minogue: Thermal interface material and heat sink configuration. Fry&apos s Metals, Senniger Powers Leavitt & Roedel, November 25, 2003: US06653741 (18 worldwide citation)

A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder t ...


3
Brian G Lewis, Bawa Singh, John P Laughlin, David V Kyaw, Anthony E Ingham, Attiganal N Sreeram, Leszek Hozer, Michael J Liberatore, Gerard R Minogue: Thermal interface material and solder preforms. Fry s Metals, Senniger Powers, March 6, 2007: US07187083 (13 worldwide citation)

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A t ...


4
Brian G Lewis, Bawa Singh, John P Laughlin, David V Kyaw, Anthony E Ingham, Attiganal N Sreeram, Leszek Hozer, Michael J Liberatore, Gerard R Minogue: Thermal interface material and solder preforms. Senninger Powers, February 16, 2010: US07663242 (7 worldwide citation)

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A t ...


5
David Ross McGregor, Daniel Irwin Amey Jr, Sounak Banerji, William J Borland, Karl Hartmann Dietz, Attiganal N Sreeram: Power core devices and methods of making thereof. E I du Pont de Nemours and Company, August 17, 2010: US07778038 (4 worldwide citation)

The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves ...


6
Attiganal N Sreeram, George Herbert Needham, Robert Leon Quinn: Plasma display device. Sarnoff, han hong, May 10, 2000: CN98804349

A plasma display having a transparent front panel (622) spaced from a back panel (610) which is a metal core (612) having layers of a dielectric material (614) extending over and bonded to the core. Conductive electrodes (620) are on the surface of or embedded in the dielectric layer of the back pan ...


7
Attiganal N Sreeram, Ashor N Prabhu, Leszek Hozer: Embossed plasma display back panel. Sarnoff, guo xiaodong, August 22, 2001: CN99808762

A plasma display device having a composite back plate including a metal core (110) and a ceramic barrier rib structure formed using a green ceramic tape (112) which is a combination of two glasses, a primary glass which flows back during firing and a secondary glass that has a relatively high therma ...


8
Brian G Lewis, Bawa Singh, John P Laughlin, David V Kyaw, Anthony E Ingham, Attiganal N Sreeram, Leszek Hozer, Michael J Liberatore, Gerard R Minogue: Thermal interface material and solder preforms. Fry s Metals, Senniger Powers Leavitt And Roedel, October 14, 2004: US20040200879-A1

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A t ...


9
Brian G Lewis, Bawa Singh, John P Laughlin, David V Kyaw, Anthony E Ingham, Attiganal N Sreeram, Leszek Hozer, Michael J Liberatore, Gerard R Minogue: Thermal interface material and solder preforms. Fry S Metals, Senniger Powers, June 28, 2007: US20070145546-A1

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A t ...


10
Daniel Irwin Amey, Sounak Banerji, William J Borland, David Ross McGregor, Attiganal N Sreeram, Karl Hartmann Dietz: Power core devices and methods of making thereof. E I Du Pont de Nemours And Company, Legal Patent Records Center, July 20, 2006: US20060158828-A1

A power core comprising: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded sing ...