1
Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura: Semiconductor stacked device. Hitachi, Hitachi Tobu Semiconductor, Antonelli Terry Stout & Kraus, March 30, 1993: US05198888 (173 worldwide citation)

There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and ...


2
Takahiro Nagai, Hideshi Ishihara, Yuji Takagi, Takashi Yumiba, Mamoru Shoji, Mitsuaki Oshima, Shunji Ohara, Motoshi Ito, Takashi Ishida, Atsushi Nakamura, Tadashi Jahana, Kouhei Nakata: Optical disk, optical disk recording and reproducing apparatus, method for recording, reproducing and deleting data on optical disk, and information processing system. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, August 30, 2005: US06938162 (138 worldwide citation)

A recording type optical disk on which data is recordable includes a data recording and reproducing area for recording data therein and reproducing data therefrom, and a read-only disk identification information area for recording disk identification information for identifying the optical disk ther ...


3
Atsushi Nakamura, Kunihiko Nishi: Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof. Hitachi, Antonelli Terry Stout & Kraus, July 7, 1998: US05777391 (133 worldwide citation)

A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pe ...


4
Masayasu Kawamura, Atsushi Nakamura, Yoshihiro Sakaguchi, Yoshitaka Kinoshita, Yasushi Takahashi, Yoshihiko Inoue: Semiconductor device and memory module. Hitachi, Hitachi ULSI Systems, Hitachi Tohbu Semiconductor, Antonelli Terry Stout & Kraus, July 30, 2002: US06426560 (128 worldwide citation)

Two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units. A memory module is so constructed that a plurality of such semiconductor storage devices, in ...


5
Atsushi Nakamura, Hisashi Yamagishi, Takashi Maruko, Yutaka Masutani: Solid golf ball. Bridgestone Sports, Sughrue Mion PLLC, August 13, 2002: US06431998 (122 worldwide citation)

In a solid golf ball comprising a solid core and a cover, the solid core has a multilayer construction which includes a center core and an outer core that encloses the center core. The center core is composed primarily of a resin and has a diameter of 3-20 mm and a specific gravity of 0.90-1.50. The ...


6
Atsushi Nakamura, Hisashi Yamagishi, Takashi Maruko, Yutaka Masutani: Solid golf ball. Bridgestone Sports, Sughrue Mion PLLC, August 12, 2003: US06605009 (118 worldwide citation)

In a solid golf ball comprising a solid core and a cover, the solid core has a multilayer construction which includes a center core and an outer core of at least one layer that encloses the center core. The center core is formed primarily of a resin and has a diameter from 3 mm to less than 15 mm. T ...


7
Hisashi Yamagishi, Yasushi Ichikawa, Atsushi Nakamura: Multi-piece solid golf ball. Bridgestone Sports, Sughrue Mion Zinn Macpeak & Seas PLLC, July 14, 1998: US05779563 (88 worldwide citation)

A multi-piece solid golf ball comprises a solid core and a cover of at least two layers enclosing the core and having a number of dimples in cover outer layer surface. The solid core is formed of a rubber base and has a specific gravity of at least 1.00. The cover is formed of a thermoplastic resin ...


8
Atsushi Nakamura, Hisashi Yamagishi, Takashi Maruko, Yutaka Masutani: Solid golf ball. Bridgestone Sports, Sughrue Mion PLLC, May 28, 2002: US06394912 (83 worldwide citation)

A solid golf ball comprises a solid core and a cover of at least one layer, the solid core having a multilayer construction which includes a center core and an outer core layer enclosing the center core. The center core is composed primarily of a thermoplastic resin or elastomer, and has a diameter ...


9
Jiro Tateyama, Naohisa Suzuki, Koji Fukunaga, Kiyoshi Katano, Atsushi Nakamura, Makoto Kobayashi: Data communication on a serial bus using an initial protocol which being executed in a transaction layer. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, July 23, 2002: US06425019 (75 worldwide citation)

In response to a request from a host device using an initial protocol, capability information including information indicative of a plurality of communication protocols is returned to the host device, and a communication protocol, designated by the host device based on the capability information, is ...


10
Youichiro Chaki, Atsushi Nakamura, Hiroaki Chiyokura: Modeling and deformation of 3-dimensional objects. Ricoh Company, Hiroaki Chiyokura, Oblon Spivak McClelland Maier & Neustadt P C, May 22, 2001: US06236403 (64 worldwide citation)

A method of modeling a 3-dimensional object including performing one of a rounding operation generating the 3-dimensional object from a control grid and an inverse rounding operation generating a control grid from the 3-dimensional object depending on which one of the control grid and the 3-dimensio ...