1
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yoshikatsu Mikami, Kuniteru Muto, Yoshiyuki Ikezoe: Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained. Hitachi Chemical Company, Antonelli Terry & Wands, April 26, 1988: US04740657 (112 worldwide citation)

Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insul ...


2
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, March 19, 1991: US05001542 (97 worldwide citation)

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having ...


3
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, June 9, 1992: US05120665 (91 worldwide citation)

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having ...


4
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Process for connecting circuits and adhesive film used therefor. Hitachi Chemical, Antonelli Terry Stout & Kraus, December 1, 1998: US05843251 (46 worldwide citation)

An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.


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Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Process for connecting circuits and adhesive film used therefor. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 5, 2000: US06113728 (30 worldwide citation)

An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.


6
Yasushi Goto, Atsuo Nakajima, Isao Tsukagoshi, Tomohisa Ohta, Yutaka Yamaguchi: Process for repairing circuit connections. Hitachi Chemical, Antonelli Terry Stout & Kraus, October 20, 1992: US05155906

Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous she ...