1
Richard A Elder, Randy Johnson, Dean L Frew, Arthur M Wilson: Non-destructive burn-in test socket for integrated circuit die. Texas Instruments Incorporated, B Peter Barndt, Richard L Donaldson, June 23, 1992: US05123850 (193 worldwide citation)

Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.


2
Richard A Elder, Arthur M Wilson, Susan V Bagen, Juanita G Miller: Method for fabrication of probe card for testing of semiconductor devices. Texas Instruments Incorporated, Gary C Honeycutt, Richard L Donaldson, William E Hiller, July 6, 1993: US05225037 (191 worldwide citation)

A flexible polyimide film is used to support an array of precisely located contact bumps which are used to probe die on a wafer of semiconductor circuits, or an unmounted integrated circuit die, several integrated circuits, or hybrid devices. By utilizing a standard I/O contact pattern for the flexi ...


3
Arthur M Wilson: Method for producing an integrated circuit product having a polyimide film interconnection structure. Texas Instruments Incorporated, Leo N Heiting, N Rhys Merrett, Melvin Sharp, December 1, 1987: US04709468 (72 worldwide citation)

A method for making integrated circuits in which a polyimide/conductor multilevel film is cast on a substrate, using available or existing semiconductor processing equipment. The polyimide film is formed from readily available polyamic acid resins, and the conductor can be sputtered aluminum formed ...


4
Dean L Frew, Mark A Kressley, Arthur M Wilson, Juanita G Miller, Philip E Hecker Jr, James Drumm, Randall E Johnson, Rick Elder: Three dimensional assembly of integrated circuit chips. Texas Instruments Incorporated, Gary C Honeycutt, Richard L Donaldson, William E Hiller, July 5, 1994: US05327327 (62 worldwide citation)

The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that l ...


5
Arthur M Wilson: Integrated circuit product having a polyimide film interconnection structure. Texas Instruments Incorporated, George L Craig, Thomas W DeMond, Melvin Sharp, December 26, 1989: US04890157 (53 worldwide citation)

A method for making integrated circuits in which a polyimide/conductor multilevel film (17) in cast on a substrate (10), using available or existing semiconductor processing equipment. The polyimide film (17) is formed from readily available polyamic acid resins, and the conductor (16) can be sputte ...


6
Arthur M Wilson, David W Laks, Stephen M Davis: Process for etching sloped vias in polyimide insulators. Texas Instruments Incorporated, Mel Sharp, Rich Donaldson, Gary Honeycutt, January 18, 1983: US04369090 (29 worldwide citation)

A method for the fabrication of a cured polyamic acid film having apertures therein selectively etched to provide sidewalls sloped at a controlled angle. Such films are used in the fabrication of integrated circuits having two or more levels of metallization, to provide electrical insulation between ...


7
Prabhakar B Ghate, Arthur M Wilson, Clyde R Fuller: Maximum density interconnections for large scale integrated circuits. Texas Instruments Incorporated, Gary C Honeycutt, Richard L Donaldson, Mel Sharp, December 30, 1980: US04242698 (24 worldwide citation)

A microelectronic integrated circuit having first and second levels of thin-film metallization separated by an insulation layer is provided with a system for electrical interconnections between metallization levels, at selected locations, without requiring extra spacing between metal paths, in eithe ...


8
Robert H Taylor, Kenneth G Vickers, Bruce E Gnade, Arthur M Wilson, Charles E Primm: Clustered field emission microtips adjacent stripe conductors. Texas Instruments Incorporated, Christopher L Maginniss, W James Brady III, Richard L Donaldson, July 16, 1996: US05536993 (17 worldwide citation)

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conducto ...


9
Arthur M Wilson, Mark A Kressley, Dean L Frew, Juanita G Miller, John E Hanicak, Philip E Hecker, James M Drumm: Solder bump transfer for microelectronics packaging and assembly. Texas Instruments Incorporated, Rene E Grossman, Richard L Donaldson, Jay M Cantor, July 8, 1997: US05646068 (16 worldwide citation)

A method of making a microelectronic circuit and the connection pattern therefor including the steps of providing a substrate (3), preferably silicon and preferably including a layer of nickel (38) under a layer of gold (36) thereon. Regions are formed on the substrate for connection of electrical c ...


10
Robert H Taylor, Kenneth G Vickers, Bruce E Gnade, Arthur M Wilson, Charles E Primm: Clustered field emission microtips adjacent stripe conductors. Texas Instruments Incorporated, Christopher L Maginniss, W James Brady III, Richard L Donaldson, September 17, 1996: US05556316 (13 worldwide citation)

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conducto ...