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Christopher W Cline, Edward J Yarmchuk, Vincent A Arena, Donald A Merte, Thomas Picunko, Brian J Wojszynski, Charles J Hendricks, Michael E Scaman, Robert S Olyha Jr, Arnold Halperin: Ionization test for electrical verification. International Business Machines Corporation, Ian D MacKinnon, October 5, 2010: US07808257

A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corre ...


22
Daniel Guidotti, Arnold Halperin, Michael E Scaman, Arthur R Zingher: Thermal modulation system and method for locating a circuit defect. Scully Scott Murphy & Presser, November 1, 2001: US20010035748-A1

A system and method for locating a circuit defect, such as a short or an incipient open, in an electric circuit in a workpiece, such a Printed Circuit Board (PCB) or MultiChip Module (MCM). The circuit is connected to a device for sensitively measuring any resistance change. A thermal stimulus is ap ...


23
Christopher W Cline, Edward J Yarmchuk, Vincent A Arena, Donald A Merte, Thomas Picunko, Brian J Wojszynski, Charles J Hendricks, Michael E Scaman, Robert S Olyha, Arnold Halperin: Ionization test for electrical verification. International Business Machines Corporation, International Business Machines Corporation, Dept 18g, May 17, 2007: US20070108984-A1

A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corre ...