11
Thomas H DiStefano, Arthur E Falls, Arnold Halperin, John D Mackay: Defect detection using intermodulation signals. International Business Machines Corporation, Philip J Feig, September 19, 1989: US04868506 (15 worldwide citation)

In order to test conductors on substrates for current constricting defects, such as cracks, narrow conductors, line breaks and intermittent opens, a test signal combining two alternating current signals at different frequencies and direct current offset signal is applied to the conductor. Upon encou ...


12
Leping Li, Steven George Barbee, Arnold Halperin, Richard Mars Ruggiero, William Joseph Surovie: Rotary signal coupling for chemical mechanical polishing endpoint detection with a strasbaugh tool. International Business Machines Corporation, Alison D Mortinger, June 23, 1998: US05770948 (14 worldwide citation)

An apparatus for rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process by a polisher is provided with a sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process, a conductor coupled to the sensor for rec ...


13
Michael E Scaman, Edward J Yarmchuk, Arnold Halperin: Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards. International Business Machines Corporation, H Daniel Schurmann, June 5, 2001: US06242923 (11 worldwide citation)

A method of locating in a non-destructive and non-invasive manner power plane-to-power plane shorts or I/O net-to-power plane shorts found in a printed circuit board or a multi-chip-module by way of a magnetic field generating probe is described. Thousands of nets can be simultaneously tested to det ...


14
Vincent Di Milia, Arnold Halperin, Morris A Koblenz: Digital evaporation monitor system. International Business Machines Corporation Armonk NY, Hanifin & Jancin, John A Jordan, September 5, 1972: US3689747 (8 worldwide citation)

The thickness and rate of evaporation are determined by digitally monitoring the change in frequency effected by the increasing thickness of deposited evaporation on the monitor crystal of the monitor oscillator in the evaporation stream. A preset digital count is loaded into a counter arrangement a ...


15
Bernell E Argyle, Arnold Halperin, Michael E Scaman, Edward J Yarmchuk: Method and apparatus for locating power plane shorts using polarized light microscopy. International Business Machines Corporation, Tiffany L Townsend, Ratner & Prestia, October 31, 2000: US06141093 (7 worldwide citation)

An apparatus and corresponding method for detecting, locating, or defining a short in a thin-film module. The apparatus includes a mechanical fixture supporting the module. A current source provides a current pulse to the module which produces a magnetic field and heating nearby the short which turn ...


16
Shinwu Chiang, Huntington W Curtis, Arthur E Falls, Arnold Halperin, John P Karidis, John D Mackay, Danny C Wong, Ka Chiu Woo, Li Cheng Zai: System and method for testing and fault isolation of high density passive boards and substrates. International Business Machines Corporation, Ratner & Prestia, March 28, 1995: US05402072 (5 worldwide citation)

Apparatus and method are disclosed for performing testing and fault isolation of high density passive boards (e.g. unpopulated circuit boards) and substrates. Using a small number of moving probes, simultaneous network resistance and network capacitance measurements may be performed. Thus, test time ...


17
Shinwu Chiang, Huntington W Curtis, Arthur E Falls, Arnold Halperin, John P Karidis, John D Mackay, Danny C Y Wong, Ka Chiu Woo, Li Cheng Zai: System and method for testing and fault isolation of high density passive boards and substrates. International Business Machines Corporation, Ratner & Prestia, April 15, 1997: US05621327 (5 worldwide citation)

Apparatus and method are disclosed for performing testing and fault isolation of high density passive boards and substrates. Using a small number of moving probes, simultaneous network resistance and network capacitance measurements may be performed. Thus, test time is minimized by eliminating the n ...


18
Daniel Guidotti, Arnold Halperin, Michael E Scaman, Arthur R Zingher: Thermal modulation system and method for locating a circuit defect. International Business Machines Corporation, Steven Capella Esq, Scully Scott Murphy & Presser, June 4, 2002: US06400128 (5 worldwide citation)

A system and method for locating a circuit defect, such as a short or an incipient open, in an electric circuit in a workpiece, such a Printed Circuit Board (PCB) or MultiChip Module (MCM). The circuit is connected to a device for sensitively measuring any resistance change. A thermal stimulus is ap ...


19
Daniel Guidotti, Arnold Halperin, Michael E Scaman, Arthur R Zingher: Thermal modulation system and method for locating a circuit defect such as a short or incipient open independent of a circuit geometry. International Business Machines Corporation, Steven Capella Esq, Scully Scott Murphy & Presser, May 22, 2001: US06236196 (1 worldwide citation)

A system and method for locating a circuit defect, such as a short or an incipient open, in an electric circuit in a workpiece, such a Printed Circuit Board (PCB) or MultiChip Module (MCM). The circuit is connected to a device for sensitively measuring any resistance change. A thermal stimulus is ap ...


20
Cyprian E Uzoh, Stephen A Cohen, Arnold Halperin: Method to test devices on high performance ULSI wafers. International Business Machines Corporation, Joseph P Abate, Connolly Bove Lodge & Hutz, January 8, 2002: US06337218 (1 worldwide citation)

An apparatus for testing structures in semiconductor wafers. The apparatus includes at least one test probe. At least one tool measures and controls deceleration of the at least one test probe as it approaches a surface of a structure in the semiconductor wafer.