1
Anthony Michael Palagonia, Paul Joseph Pikna, John Thomas Maddix: Micro probe assembly and method of fabrication. International Business Machines Corporation, Robert A Walsh, May 9, 2000: US06059982 (131 worldwide citation)

A probe assembly including an integral fine probe tip, conductive line with terminal connection for testing semiconductor devices and a method of construction of the probe assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce mol ...


2
John Thomas Maddix, Anthony Michael Palagonia, Paul Joseph Pikna, David Paul Vallett: Micro probe ring assembly and method of fabrication. International Business Machines Corporation, Robert A Walsh, January 11, 2000: US06014032 (68 worldwide citation)

A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon ...


3
Patricia McGuinness Marmillion, Anthony Michael Palagonia, Bernadette Ann Pierson, Dennis Arthur Schmidt: Cooling method for silicon on insulator devices. International Business Machines Corporation, William D Sabo, June 5, 2001: US06242778 (63 worldwide citation)

In a silicon on insulator technology, cooling channels in a support substrate are located substantially under the junction regions of selected individual active devices in a semiconductor layer, where the junction regions are separated from the substrate by an insulating layer. In a second embodimen ...


4
Anthony Michael Palagonia: Wafer with elevated contact structures. International Business Machines Corporation, Robert A Walsh, February 23, 1999: US05874782 (43 worldwide citation)

Disclosed is a semiconductor wafer, and the method of making the same, the wafer being formed to have a multiplicity of raised contact pads on its surface. The contact pads are formed with conductors which are disposed on the surface of the wafer and which are coupled to internal circuitry embedded ...


5
John Thomas Maddix, Anthony Michael Palagonia, Paul Joseph Pikna, David Paul Vallett: Micro probe ring assembly and method of fabrication. International Business Machines Corporation, Robert A Walsh, May 15, 2001: US06232143 (35 worldwide citation)

A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon ...


6
Anthony Michael Palagonia: Method for forming an interposer for making temporary contact with pads of a semiconductor chip. International Business Machines Corporation, Robert A Walsh, February 13, 2001: US06188231 (18 worldwide citation)

An interposer for making a penetrating temporary contact between the contact pads of a chip having bumped or unbumped I/O pads and a test board for the purpose of testing said chip is disclosed. The interposer comprises a silicon substrate having sharp penetrating structures integrally formed at a p ...


7
Anthony Michael Palagonia: High density signal multiplexing interposer. International Business Machines Corporation, Robert A Walsh, April 20, 1999: US05895978 (16 worldwide citation)

A high density and high I/O count packaging methodology and associated fabrication technique is presented. A semiconductor die having logic circuits for multiplexing specified sets of I/O logic is electrically connected to an interposer having semiconductor logic circuits for multiplexing selected s ...


8
Anthony Michael Palagonia: Testing integrated circuit chips. International Business Machines Corporation, Robert A Walsh, March 14, 2000: US06037786 (13 worldwide citation)

An interposer for making a penetrating temporary contact between the contact pads of a chip having bumped or unbumped I/O pads and a test board for the purpose of testing the chip is disclosed. The interposer comprises a silicon substrate having sharp penetrating structures integrally formed at a pr ...


9
Bruno Roberto Aimi, John Edward Cronin, Andre Conrad Forcier, James Marc Leas, Patricia McGuinnes Marmillion, Anthony Michael Palagonia, Bernadette Ann Pierson, Dennis Arthur Schmidt: Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses. International Business Machines Corporation, Heslin & Rothenberg P C, October 21, 1997: US05679609 (12 worldwide citation)

A multichip semiconductor structure and fabrication method having connect assemblies with fuses which facilitate burn-in stressing and electrical testing of the structure are presented. The structure comprises a multichip stack having standard transfer wire outs to an edge surface thereof. At least ...


10
Anthony Michael Palagonia: Wafer with elevated contact substructures. International Business Machines Corporation, Robert A Walsh Esq, May 25, 1999: US05907785 (10 worldwide citation)

Disclosed is a semiconductor wafer, and the method of making the same, the wafer being formed to have a multiplicity of raised contact pads on its surface. The contact pads are formed with conductors which are disposed on the surface of the wafer and which are coupled to internal circuitry embedded ...