1
Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, Timothy J Dalton, Ebenezer E Eshun, Jeffrey P Gambino, Anthony K Stamper, Richard P Volant: Structure and method for self aligned vertical plate capacitor. International Business Machines Corporation, Cantor Colburn, Katherine Brown, March 2, 2010: US07670921 (22 worldwide citation)

A method of forming a metal-insulator-metal (MIM) capacitor includes forming a first planar dielectric layer with a first metallization layer therein; forming a first passivation layer on top thereof; forming a planar conductive layer above the first passivation layer; patterning and selectively rem ...


2
Eb Eshun
Douglas D Coolbaugh, Daniel C Edelstein, Ebenezer E Eshun, Zhong Xiang He, Robert M Rassel, Anthony K Stamper: Terminal pad structures and methods of fabricating same. International Business Machines Corporation, Schmeiser Olsen & Watts, Steven Capella, April 22, 2008: US07361993 (11 worldwide citation)

Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The methods including forming the terminal p ...


3
Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, Ebenezer E Eshun, Zhong Xiang He, Jeffrey B Johnson, Jonghae Kim, Jean Oliver Plouchart, Anthony K Stamper: Passive components in the back end of integrated circuits. International Business Machines Corporation, Anthony J Canale, August 3, 2010: US07768055 (10 worldwide citation)

Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical ...


4
Eb Eshun
Anthony K Stamper, Anil K Chinthakindi, Douglas D Coolbaugh, Timothy J Dalton, Daniel C Edelstein, Ebenezer E Eshun, Jeffrey P Gambino, William J Murphy, Kunal Vaed: Air gap under on-chip passive device. International Business Machines Corporation, Lisa U Jaklitsch, Daryl K Neff, February 16, 2010: US07662722 (10 worldwide citation)

A method is provided for fabricating a microelectronic chip which includes a passive device such, as an inductor, overlying an air gap. In such method, a plurality of front-end-of-line (“FEOL”) devices are formed in a semiconductor region of the microelectronic chip, and a plurality of stacked inter ...


5
Eb Eshun
Douglas D Coolbaugh, Hanyi Ding, Ebenezer E Eshun, Michael D Gordon, Zhong Xiang He, Anthony K Stamper: Integrated parallel plate capacitors. International Business Machines Corporation, Anthony J Canale, January 12, 2010: US07645675 (6 worldwide citation)

A parallel plate capacitor formed in the back end of an integrated circuit employs conductive capacitor plates that are formed simultaneously with the other interconnects on that level of the back end (having the same material, thickness, etc). The capacitor plates are set into the interlevel dielec ...


6
Eb Eshun
Daniel C Edelstein, Anil K Chinthakindi, Timothy J Dalton, Ebenezer E Eshun, Jeffrey P Gambino, Sarah L Lane, Anthony K Stamper: Integrated circuit comb capacitor. International Business Machines Corporation, Lisa U Jaklitsch, September 8, 2009: US07585722 (6 worldwide citation)

The invention is directed to an integrated circuit comb capacitor with capacitor electrodes that have an increased capacitance between neighboring capacitor electrodes as compared with other interconnects and via contacts formed in the same metal wiring level and at the same pitches. The invention a ...


7
Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, John M Cotte, Ebenezer E Eshun, Zhong Xiang He, Anthony K Stamper, Eric J White: Integrated BEOL thin film resistor. International Business Machines Corporation, Anthony J Canale, March 8, 2011: US07902629 (5 worldwide citation)

In the course of forming a resistor in the back end of an integrated circuit, an intermediate dielectric layer is deposited and a trench etched through it and into a lower dielectric layer by a controllable amount, so that the top of a resistor layer deposited in the trench is close in height to the ...


8
Eb Eshun
Anil K Chinthakindi, Timothy J Dalton, Ebenezer E Eshun, Jeffrey P Gambino, Anthony K Stamper, Kunal Vaed: Methods of fabricating passive element without planarizing and related semiconductor device. International Business Machines Corporation, Lisa Jaklitsch, Hoffman Warnick, July 1, 2008: US07394145 (5 worldwide citation)

Methods of fabricating a passive element and a semiconductor device including the passive element are disclosed including the use of a dummy passive element. A dummy passive element is a passive element or wire which is added to the chip layout to aid in planarization but is not used in the active c ...


9
Eb Eshun
Douglas D Coolbaugh, Daniel C Edelstein, Ebenezer E Eshun, Zhong Xiang He, Robert M Rassel, Anthony K Stamper: Terminal pad structures and methods of fabricating same. International Business Machines Corporation, Schmeiser Olsen & Watts, Steven Capella, February 24, 2009: US07494912 (5 worldwide citation)

Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The methods including forming the terminal p ...


10
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy: Heat sink for integrated circuit devices. International Business Machines Corporation, Anthony Canale, Roberts Mlotkowski Safran & Cole P C, August 9, 2011: US07994895 (4 worldwide citation)

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...