1
Amr M Mohsen, Esmat Z Hamdy, John L McCollum: Method of making programmable low impedance interconnect diode element. Actel Corporation, Lyon & Lyon, October 24, 1989: US04876220 (385 worldwide citation)

A programmable low impedance interconnect diode element is disclosed having a lower electrode formed of a semiconductor material of a first conductivity type covered by an insulating dielectric layer which may be in a preferred embodiment comprised of an initial layer of silicon dioxide, a second la ...


2
Amr M Mohsen, Esmat Z Hamdy, John L McCollum: Selectively formable vertical diode circuit element. Actel Corporation, Lyon & Lyon, November 14, 1989: US04881114 (265 worldwide citation)

A programmable low impedance interconnect diode element is disclosed having a lower electrode formed of a semiconductor material of a first conductivity type covered by an insulating dielectric layer which may be in a preferred embodiment comprised of an initial layer of silicon dioxide, a second la ...


3
Amr M Mohsen, Esmat Z Hamdy, John L McCullum: Programmable low impedance anti-fuse element. Actel Corporation, Lyon & Lyon, April 18, 1989: US04823181 (236 worldwide citation)

An electrically programmable low impedance circuit element is disclosed having capacitor-like structure with very low leakage before programming and a low resistance after programming. The electrically programmable low impedance circuit element of the present invention includes a lower conductive el ...


4
Esmat Z Hamdy, Amr M Mohsen, John L McCullum: Electrically-programmable low-impedance anti-fuse element. Actel Corporation, Lyon & Lyon, February 6, 1990: US04899205 (193 worldwide citation)

Electrically-programmable low-impedance anti-fuses are disclosed having capacitor-like structure with very low leakage before programming and a low resistance after programming. The electrically-programmable low-impedance anti-fuses of the present invention include a first conductive electrode which ...


5
Amr M Mohsen, Esmat Z Hamdy, John L McCullum: Programmable low impedance anti-fuse element. Actel Corporation, Lyon & Lyon, July 24, 1990: US04943538 (177 worldwide citation)

An electrically programmable low impedance circuit element is disclosed having capacitor-like structure with very low leakage before programming and a low resistance after programming. The electrically programmable low impedance circuit element of the present invention includes a lower conductive el ...


6
Amr M Mohsen, Dwight L Crook: Fusible link employing capacitor structure. Intel Corporation, Blakely Sokoloff Taylor & Zafman, September 24, 1985: US04543594 (154 worldwide citation)

A capacitor-like MOS structure which provides a fusible link useful in a ROM, redundancy circuit, or the like is disclosed. An oxide layer insulates a polysilicon electrode from a doped substrate region. A potential is applied between the electrode and the doped region of sufficient magnitude to cau ...


7
Khaled A El Ayat, Abbas El Gamal, Amr M Mohsen: Testing apparatus and diagnostic method for use with programmable interconnect architecture. Actel Corporation, Lyon & Lyon, August 15, 1989: US04857774 (106 worldwide citation)

A user-programmable interconnect architecture, which may be used for logic arrays for digital and analog system design, is disclosed. In one embodiment, a plurality of logic cells or modules in a matrix are connected by vertical and horizontal wiring channels. The wiring channels may in turn be prog ...


8
Esmat Z Hamdy, Amr M Mohsen, John L McCullum: Programmable low-impedance anti-fuse element. Actel Corporation, Kenneth D Alessandro, July 28, 1992: US05134457 (63 worldwide citation)

Electrically-programmable low-impedance anti-fuses are disclosed having capacitor-like structure with very low leakage before programming and a low resistance after programming. The electrically-programmable low-impedance anti-fuses of the present invention include a first conductive electrode which ...


9
Amr M Mohsen: Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits. Aptix Corporation, Skjerven Morrill MacPherson Franklin & Friel, December 6, 1994: US05371390 (56 worldwide citation)

An interconnect structure contains a substrate, a layer of separate conductive leads extending over the substrate in one direction, and another layer of separate conductive leads extending over the substrate in another, substantially different, direction. At least one conductive lead in each of the ...


10
Amr M Mohsen: Interconnect structure with programmable IC for interconnecting electronic components, including circuitry for controlling programmable IC. Aptix Corporation, Ronald J Meetin, Skjerven Morrill MacPherson Franklin & Friel, August 5, 1997: US05654564 (53 worldwide citation)

An interconnect structure is centered around a substrate having multiple component contacts for receiving electronic components. Multiple conductive traces are provided on the substrate. Each conductive trace is electrically connected to one of the component contacts. A programmable IC having a grou ...