1
Philip A Johnson, Alfred F McCarthy: Electronic chip-carrier heat sinks. Aavid Engineering, James E Mrose, July 7, 1987: US04679118 (112 worldwide citation)

Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both me ...


2
Philip A Johnson, Alfred F McCarthy: Self-fastened heat sinks. Aavid Engineering, James E Mrose, November 25, 1980: US04235285 (104 worldwide citation)

Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a tab or other heat-transfer body freely between two relatively-movable oppositely-disposed broad-area portions of the structure and which then closes and yieldin ...


3
Philip A Johnson, Alfred F McCarthy: Self-fastened heat sinks. Aavid Engineering, James E Mrose, May 20, 1980: US04203488 (64 worldwide citation)

Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a substantially flat tab or other heat-transfer body freely between two relatively-movable oppositely-disposed broad-area portions of the structure and which then ...


4
Philip A Johnson, Alfred F McCarthy: Heat sinks for integrated circuit modules. Aavid Engineering, James E Mrose, November 12, 1985: US04552206 (41 worldwide citation)

In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelepiped body, an elongated sheet-metal strip of heat-radiating elements disp ...


5
Alfred F McCarthy: Winged self-fastened heat sinks for semiconductor devices. Aavid Engineering, James E Mrose, July 29, 1980: US04215361 (36 worldwide citation)

Heat accumulating about the plastic housing and metallic tab of a miniature electronic semiconductor power device is dissipated by a surrounding one-piece sheet metal heat sink shaped as a closely-fitting channel portion closed at the bottom but open-slotted midway along the top; from margins of the ...


6
Philip A Johnson, Alfred F McCarthy: Heat sink fastenings. Aavid Engineering, James E Mrose, March 23, 1982: US04321423 (34 worldwide citation)

Auxiliary heat-sink attachments which promote dissipation of heat from electronic solid-state devices and the like are secured with such devices and with associated printed-circuit boards by way of accessory fastenings with which they form a sub-assembly wave-solderable in pre-spaced relation to the ...


7
Alfred F McCarthy: Heat sinks for integrated circuit modules. Aavid Engineering, James E Mrose, April 2, 1985: US04508163 (29 worldwide citation)

In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet-metal strip of heat-radiating elements dispo ...


8
Alfred F McCarthy: Heat sinks with staked solderable studs. Aavid Engineering, James E Mrose, October 1, 1985: US04544942 (23 worldwide citation)

Heat sinks of the type which are fitted onto electronic solid-state devices to maintain acceptable thermal equilibrium conditions are provided with solderable sheet-metal appendages or studs staked onto their relatively cooler portions by way of punching which deforms and flows the heat-sink materia ...


9
Alfred F McCarthy: Miniature heat sink. Aavid Engineering, James E Mrose, April 7, 1981: US04261005 (17 worldwide citation)

A one-piece stamped sheet-metal heat sink for dissipation of heat which accumulates about the plastic housing and metallic tab of a miniature semiconductor power device is formed as a shallow open-topped channel having short upstanding sides which flare laterally outwardly and then upwardly and then ...


10
Alfred F McCarthy: V-shaped clip for attaching a semiconductor device to a heat sink. Avvid Engineering, Fish & Richardson, October 23, 1990: US04964198 (15 worldwide citation)

A resilient spring clip for attaching a semiconductor to a heat sink comprising a first surface and an attachment means, the attachment means comprising a pair of V-shaped legs adapted to fit into and be secured to a slot in a heat sink so that the first surface spring-engages the semiconductor and ...