1
Koji Fujisaki, Akio Nishikawa, Shunichi Numata, Hiroshi Suzuki, Takeshi Komaru, Daisuke Makino: Resin encapsulated semiconductor device. Hitachi, Hitachi Chemical, Antonelli Terry & Wands, July 19, 1988: US04758875 (59 worldwide citation)

Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the a ...


2
Noriyuki Kinjo, Akio Nishikawa, Junichi Katagiri, Hitoshi Yokono, Tamotsu Ikeda, Tsuguo Kobayashi: Dynamoelectric machine having coil windings and core encapsulated with resin-filler composition. Hitachi, Craig & Antonelli, December 5, 1978: US04128527 (52 worldwide citation)

In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsatu ...


3
Akio Nishikawa, Masashi Shitara, Susumu Era, Toshiaki Fukushima, Hiroshi Suzuki, Hisashi Kohkame: Ether imides and process for producing the same. Hitachi, Antonelli Terry and Wands, July 17, 1984: US04460783 (32 worldwide citation)

An ether imide of the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6 and D are as defined in the specification produced by reacting a diamine with an ethylenically unsaturated dicarboxylic acid can give a composition together with one or more unsaturated polyesters, e ...


4
Akio Takahashi, Moloyo Wajima, Akio Nishikawa, Hirosada Morishita: Maleimide: aryloxy diamine resin composition and process for producing same. Hitachi, Antonelli Terry & Wands, March 6, 1984: US04435560 (14 worldwide citation)

The disclosure is concerned with a maleimide-diamine resin composition which is well soluble to a low boiling point solvent and is excellent in heat resistance. The composition is featured by containing a maleimide-diamine adduct having the general formula: ##STR1## wherein A is a mono-, di-, tri- o ...


5
Motoo Yamaguchi, Isamu Sone, Kunio Hirasawa, Yoshio Yoshioka, Akio Nishikawa, Hiroshi Suzuki, Mikio Sato, Masao Hosokawa: SF.sub.6 Gas arc extinguishing electric apparatus and process for producing the same. Hitachi, Antonelli Terry & Wands, December 31, 1985: US04562322 (13 worldwide citation)

A SF.sub.6 gas insulating electric apparatus usable as a circuit breaker, etc., containing a SF.sub.6 gas insulator and a resin insulator, both of which insulators are present in an atmosphere to be exposed to arcs, characterized by making at least the surface portion to be exposed to arcs of the re ...


6
Hiroshi Suzuki, Goro Tanaka, Akio Nishikawa, Junji Mukai, Mikio Sato, Daisuke Makino, Yoshiaki Wakashima: Semiconductor memories with .alpha. shield. Hitachi, Hitachi Chemical Company, Antonelli Terry & Wands, January 15, 1985: US04494217 (12 worldwide citation)

In a semiconductor memory device comprising semiconductor memory elements having such a degree of integration in memory circuits as to produce soft errors by incident .alpha.-rays derived from a packaging material and a package which packages the memory elements and is made from the packaging materi ...


7
Akio Nishikawa, Junichi Katagiri, Noriyuki Kinjo, Hitoshi Yokono, Tamotsu Ikeda, Tsuguo Kobayashi: Unsaturated polyester resin composition for use in pressure molding. Hitachi, Craig & Antonelli, July 8, 1980: US04211686 (11 worldwide citation)

An unsaturated polyester resin composition for use in pressure molding, which comprises an unsaturated polyester resin and fillers consisting essentially of (a) calcium carbonate powder which passes a 325 mesh sieve, (b) an inorganic mineral particulate which passes a 12 mesh sieve and is retained o ...


8
Hitoshi Yokono, Akio Nishikawa, Ritsuro Tada, Yasuo Miyadera: Epoxy resin composition having excellent latent hardening characteristics. Hitachi, Hitachi Chemical Company, Craig & Antonelli, June 15, 1976: US03963796 (8 worldwide citation)

An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection ...


9
Hiroyoshi Kokaku, Masatsugu Ogata, Masanori Segawa, Hiroshi Hozoji, Akio Nishikawa, Fumio Sato: Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same. Hitachi, Antonelli Terry Stout & Kraus, July 6, 1993: US05225499 (6 worldwide citation)

A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains:


10
Akio Nishikawa, Hitoshi Yokono, Ryuichi Simizu, Junji Mukai: Resin compositions containing polyepoxides and uretdiones. Hitachi, Craig & Antonelli, February 6, 1979: US04138372 (6 worldwide citation)

A polymerizable, curable resin composition suitable for molding materials, prepreg, powdery paint materials or the like, which comprises a polyepoxide, a uretdione and a tetraphenyl borate-amine complex. This composition has long pot life and good curability by virtue of latent catalytic characteris ...