1
Frank J Gaughan, Aki Nomura, Kiyoshi Hatakeyama, John Washington McCoy, Yoichi Hamano: Ceramic multilayer helical antenna for portable radio or microwave communication apparatus. Kyocera America, Loeb & Loeb, April 4, 2000: US06046707 (39 worldwide citation)

A small and durable antenna for use with radio and microwave communications is formed as a helical conductor contained in a multilayered non-ferrite ceramic chip. The dielectric constant of the ceramic is selected to match the antenna to its operating frequency, which may be in the range of 0.5 to 1 ...


2
Henry Beppu, Toshi Kushuhara, Aki Nomura: Ceramic-glass integrated circuit package with ground plane. Kyocera America, Spensley Horn Jubas & Lubitz, February 12, 1991: US04992628 (26 worldwide citation)

A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve ...


3
Taka Irie, Aki Nomura: Leadless ceramic package with improved solderabilty. Kyocera America, Spensley Horn Jubas & Lubitz, May 24, 1994: US05314606 (22 worldwide citation)

A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal ex ...


4
Henry Beppu, Toshi Kusuhara, Aki Nomura: Ceramic glass integrated circuit package with integral ground and power planes. Kyocera America, Spensley Horn Jubas & Lubitz, November 2, 1993: US05258575 (12 worldwide citation)

A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to ser ...


5
Henry Beppu, Toshi Kusuhara, Aki Nomura: Ceramic-glass integrated circuit package with integral ground and power planes. Kyocera America, Spensley Horn Jubas & Lubitz, July 28, 1992: US05134246 (10 worldwide citation)

A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to ser ...


6
Aki Nomura, Hisanori Kachi, Makoto Matsuzawa, Hiromu Tokura, Minaho Komori: Water-based cosmetic. The Nisshin OilliO Group, Wood Herron & Evans, April 17, 2018: US09943474

A water-based cosmetic including: agar having a weight average molecular weight of 10,000 to 60,000 (component (A)); xanthan gum (component (B)); and a water-soluble polymer excluding the component (A) or (B) (component (C)).