1
Ed Rutter
Edward Rutter, Ahila Krishnamoorthy, Joseph Kennedy: Processable inorganic and organic polymer formulations, methods of production and uses thereof. Honeywell International, March 3, 2011: US20110054119-A1

Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations ar ...


2
Ahila Krishnamoorthy, David J Duquette, Shyam P Murarka: Copper alloy electroplating bath for microelectronic applications. Semitool, Christensen O&apos Connor Johnson Kindness PLLC, November 20, 2001: US06319387 (146 worldwide citation)

A metallized structure for use in a microelectronic circuit is set forth. The metallized structure comprises a dielectric layer, an ultra-thin film bonding layer disposed exterior to the dielectric layer, and a low-Me concentration, copper-Me alloy layer disposed exterior to the ultra-thin film bond ...


3
Ahila Krishnamoorthy, David J Duquette, Shyam P Murarka: Metallization structures for microelectronic applications and process for forming the structures. Semitool, Christensen O&apos Connor Johnson Kindness PLLC, April 9, 2002: US06368966 (28 worldwide citation)

A metallized structure for use in a microelectronic circuit is set forth. The metallized structure comprises a dielectric layer, an ultra-thin film bonding layer disposed exterior to the dielectric layer, and a low-Me concentration, copper-Me alloy layer disposed exterior to the ultra-thin film bond ...


4
Ahila Krishnamoorthy, David J Duquette, Shyam P Murarka: Metallization structures for microelectronic applications and process for forming the structures. Semitool, Christensen O&apos Connor Johnson Kindness PLLC, November 26, 2002: US06486533 (16 worldwide citation)

A metallized structure for use in a microelectronic circuit is set forth. The metallized structure comprises a dielectric layer, an ultra-thin film bonding layer disposed exterior to the dielectric layer, and a low-Me concentration, copper-Me alloy layer disposed exterior to the ultra-thin film bond ...


5
Qiang Guo, Ahila Krishnamoorthy, Xiaomei Bu, Vladimir N Bliznetsov: Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects. Agency for Science Technology and Research, George O Saile, Stephen B Ackerman, July 5, 2005: US06913994 (9 worldwide citation)

An improved method of forming a dual damascene structure that includes an organosilicate glass (OSG) dielectric layer is described. A via first process is followed in which a via is formed in the OSG layer and preferably stops on a SiC layer. The SiC layer is removed prior to stripping a photoresist ...


6
Ahila Krishnamoorthy, Richard Spear, Amanuel Gebrebrhan: Compositions, layers and films for optoelectronic devices, methods of production and uses thereof. Faegre Baker Daniels, December 2, 2014: US08901268 (6 worldwide citation)

Crosslinkable compositions are disclosed herein that comprise at least one silicon-based material comprising at least one alkyl group and at least one aryl or aromatic group, at least one catalyst, and at least one solvent.


7
Ramanath Ganapathiraman, Ahila Krishnamoorthy, Kaushik Chanda, Shyam P Murarka: Diffusion barriers comprising a self-assembled monolayer. Rensselaer Polytechnic Institute, David J Aston, Peters Verny, April 10, 2007: US07202159 (3 worldwide citation)

The present invention provides a method for forming a diffusion barrier layer, a diffusion barrier in an integrated circuit and an integrated circuit. The method for forming a diffusion barrier involves the following steps: 1) preparing a silicon substrate; 2) contacting the silicon substrate with a ...


8
Edward Rutter Jr, Ahila Krishnamoorthy, Joseph Kennedy: Processable inorganic and organic polymer formulations, methods of production and uses thereof. Honeywell International, Faegre Baker Daniels, October 14, 2014: US08859673

Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations ar ...


9
Ahila Krishnamoorthy, Robert James Bogert, Yipeng Yan: Magnetic component assembly with filled physical gap. COOPER TECHNOLOGIES COMPANY, Armstrong Teasdale, January 16, 2018: US09870856

Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic co ...


10
Ahila Krishnamoorthy, Daniel R Alexander: Absorbent glass mat separators, VRLA batteries, and related methods of manufacture and use. Daramic, Hammer & Associates P C, August 21, 2018: US10056592

Disclosed herein are soluble content absorbent glass mats or AGM separators for VRLA, AGM, or VRLA AGM batteries. Such glass mats may be prepared from insoluble glass fibers blended with soluble content materials. Upon exposure to a suitable solvent, the dissolving or solvating of the soluble conten ...