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Vincent Le Chevalier Vincent Le Chevalier
Brady Duga, Garth Conboy, William Leshner, John Rivlin, Vincent Le Chevalier: System and method for selective control of zoom adjustments in an electronic publication. Google, Fenwick & West, September 9, 2014: US08832548

A system and method for selective control of zoom adjustments in an electronic publication is disclosed. The method may include generating content for display on an electronic reading device; generating at least one style for the content, and storing the content and the at least one style on a compu ...


2
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: Co-support component and microelectronic assembly. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08848391

A component is configured for connection with a microelectronic assembly having terminals and a microelectronic element connected with the terminals. The component includes a support structure bearing conductors configured to carry command and address information, and a plurality of contacts coupled ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: Co-support module and microelectronic assembly. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08848392

A module is configured for connection with a microelectronic assembly having terminals and a microelectronic element. The module includes a circuit panel bearing conductors configured to carry command and address information, co-support contacts coupled to the conductors, and module contacts coupled ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Simon McElrea: Microelectronic assembly with thermally and electrically conductive underfill. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08847412

A microelectronic assembly may include a microelectronic element having a surface and a plurality of contacts at the surface; a first element consisting essentially of at least one of semiconductor or dielectric material, the first element having a surface facing the surface of the microelectronic e ...


5
Ivo Koutsaroff 掘露 伊保龍
Ivoyl Koutsaroff, Shinichi Higai, Akira Ando: Perovskite material with anion-controlled dielectric properties, thin film capacitor device, and method for manufacturing the same. Murata Manufacturing, Keating & Bennett, September 30, 2014: US08848336 (2 worldwide citation)

A crystalline perovskite crystalline composite paraelectric material includes nano-regions containing rich N3− anions dispersed in a nano-grain sized matrix of crystalline oxide perovskite material, wherein (ABO3-δ)α-(ABO3-δ-γNγ)1-α. A represents a divalent element, B represents a tetravalent elemen ...


6
Somakumar R
Adnan Kutubuddin Bohori, Somakumar Ramachandrapanicker, Suma Memana Narayana Bhat: System and method for contactless power transfer in implantable devices. General Electric Company, Ann M Agosti, September 30, 2014: US08849402

A system and method for contactless power transfer in implantable devices for charging rechargeable batteries disposed within the implantable devices are provided. The system includes a first coil electrically couplable to a power source, wherein the first coil is configured to produce a magnetic fi ...


7
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Staged via formation from both sides of chip. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08847380

A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respect ...


8
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia: Microelectronic elements with post-assembly planarization. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08847376 (3 worldwide citation)

A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microele ...


9
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Three-dimensional system-in-a-package. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 23, 2014: US08841763

A microelectronic assembly can include first, second and third stacked substantially planar elements, e.g., of dielectric or semiconductor material, and which may have a CTE of less than 10 ppm/° C. The assembly may be a microelectronic package and may incorporate active semiconductor devices in one ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Piyush Savalia: Multi-chip module with stacked face-down connected dies. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 23, 2014: US08841765 (4 worldwide citation)

A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate ...



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