1
Guoxiao Guo Guoxiao Guo
Wai Ee Wong, Xiaotian Xu, Jinchuan Zheng, Guoxiao Guo, Jie Yu: Disk drive increasing bandwidth of cutoff filter while reading servo sector preamble. Western Digital Technologies, February 18, 2014: US08654467 (93 worldwide citation)

A disk drive is disclosed comprising a disk including a plurality of servo tracks defined by servo sectors, wherein each servo sector comprises a servo preamble. A head is actuated over the disk, wherein the head is operable to generate a read signal. The disk drive further comprises control circuit ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659164 (20 worldwide citation)

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659142 (20 worldwide citation)

A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically ...


4
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659143 (20 worldwide citation)

A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semic ...


5
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659141 (20 worldwide citation)

A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the f ...


6
Dr. Elke Erben
Elke Erben, Martin Trentzsch, Richard J Carter: Passivating point defects in high-K gate dielectric layers during gate stack formation. GLOBALFOUNDRIES, Amerson Law Firm PLLC, February 25, 2014: US08658490

Generally, the present disclosure is directed to techniques for improving the reliability of semiconductor devices with high-k gate dielectric layers by passivating point defects during the gate stack formation. One illustrative method disclosed herein includes performing a plurality of material dep ...


7
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659140 (20 worldwide citation)

A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with at least one external component. The substrate can h ...


8
James Kraemer Ph.D.
Robert R Friedlander, James R Kraemer: Cohort driven selection of medical diagnostic tests. International Business Machines Corporation, John R Pivnichny, Law Office of Jim Boice, February 18, 2014: US08655681

A computer implemented method, system, and/or computer program product creates a suggested diagnostic test selection. A description of a current patient includes a current medical complaint, medical history, and physical examination result for the current patient. A cohort for the current patient is ...


9
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 18, 2014: US08653646 (20 worldwide citation)

A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and ...


10
Dr. Elke Erben
Sven Schmidbauer, Dina H Triyoso, Elke Erben, Hao Zhang, Robert Binder: Methods for fabricating integrated circuits with narrow, metal filled openings. GLOBALFOUNDRIES, Ingrassia Fisher & Lorenz P C, February 18, 2014: US08652890

Methods are provided for fabricating an integrated circuit that includes metal filled narrow openings. In accordance with one embodiment a method includes forming a dummy gate overlying a semiconductor substrate and subsequently removing the dummy gate to form a narrow opening. A layer of high diele ...



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