1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659164 (53 worldwide citation)

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


2
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659142 (29 worldwide citation)

A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659141 (29 worldwide citation)

A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the f ...


4
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659143 (29 worldwide citation)

A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semic ...


5
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659140 (29 worldwide citation)

A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with at least one external component. The substrate can h ...


6
Sagy Pundak Mintz
Sagy P Mintz, Alexander D Deitz: Distribution of electronic market data. Trading Technologies International, McDonnell Boehnen Hulbert & Berghoff, February 25, 2014: US08660938

A system and method are provided that, among other things, can reduce the burden on receiving computers, increase data throughput, reduce system failure, and provide components of a scalable and flexible network architecture. Specifically, the system and method provide a multichannel-multicast netwo ...


7
Dr. Elke Erben
Elke Erben, Martin Trentzsch, Richard J Carter: Passivating point defects in high-K gate dielectric layers during gate stack formation. GLOBALFOUNDRIES, Amerson Law Firm PLLC, February 25, 2014: US08658490

Generally, the present disclosure is directed to techniques for improving the reliability of semiconductor devices with high-k gate dielectric layers by passivating point defects during the gate stack formation. One illustrative method disclosed herein includes performing a plurality of material dep ...


8
Leo Ren, Ynjiun Paul Wang, Yong Liu, Timothy Meier, Stephen Patrick Deloge: Indicia reading terminal with color frame processing. Metrologic Instruments, Additon Higgins Pendelton & Ashe P A, February 25, 2014: US08657200 (236 worldwide citation)

An indicia reading terminal can comprise an image sensor integrated circuit having a two-dimensional image sensor, a hand held housing encapsulating the two-dimensional image sensor, and an imaging lens configured to focus an image of a target decodable indicia onto the two-dimensional image sensor. ...


9
Rob Vargo, Ryan Zoschg, Edward Charles Borgoyn, Mike Naughton: Method and system for correctly identifying specific RFID tags. Vocollect, Wood Herron & Evans, February 25, 2014: US08659397 (234 worldwide citation)

A system and method for identifying a specific RFID tag includes RFID reader circuitry, such as within an RFID reader, configured for sending and receiving RF signals to detect RFID tags and for obtaining signal parameter information associated with the RFID tags. Processing circuitry is configured ...


10
David C Yates, James R Giordano, Frederick E Shelton IV: Motorized surgical cutting and fastening instrument having handle based power source. Ethicon Endo Surgery, February 25, 2014: US08657174 (233 worldwide citation)

A surgical cutting and fastening instrument. The instrument comprises an end effector, a shaft connected to the end effector, and a handle connected to the shaft. The handle comprises an electric, DC motor connected to a drive train in the shaft for powering the drive train. The handle also comprise ...