David Mosley Garo Khanarian
Kathleen A Auld, David M Conner, Garo Khanarian, David Wayne Mosley: Phenoxyphenyl polysiloxane composition and method for making and using same. Rohm and Haas Company, Jonathan D Baskin, January 28, 2014: US08637627

A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device ...



Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 28, 2014: US08637991 (15 worldwide citation)

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...

Craig Allen
John Wesley Harris Jr, Craig Allen Bielek, Scott Edmond Ellis, Daniel Alan Hynum, Melissa Ann Seely, Xiaoyong Fu: Apparatus and methods for cooling platform regions of turbine rotor blades. General Electric Company, Mark E Henderson, Ernest G Cusick, Frank A Landgraff, January 28, 2014: US08636471

A configuration of cooling channels through the interior of a turbine rotor blade, the turbine rotor blade including a platform at an interface between an airfoil and a root. In one embodiment, the configuration of cooling channels includes: an interior cooling passage that is configured to extend f ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Stacked microelectronic assembly having interposer connecting active chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 28, 2014: US08637968 (2 worldwide citation)

A microelectronic assembly can include first and second microelectronic elements each embodying active semiconductor devices adjacent a front surface thereof, and having an electrically conductive pad exposed at the respective front surface. An interposer of material having a CTE less than 10 ppm/° ...

James Kraemer Ph.D.
Robert Lee Angell, James R Kraemer: Generating customized marketing messages at a customer level using current events data. International Business Machines Corporation, Yee & Associates P C, John R Pivnichny, January 28, 2014: US08639563 (3 worldwide citation)

A computer implemented method, apparatus, and computer usable program code for generating customized marketing messages using current events data. In one embodiment, external marketing data is received from a set of sources to form the current events data. The current events data is processed to for ...

Abdellatif Benjelloun Touimi
Abdellatif Benjelloun Touimi: Data processing method by passage between different sub-band domains. France Telecom, Knobbe Martens Olson & Bear, January 28, 2014: US08639735 (1 worldwide citation)

The invention concerns data processing by passage between different subband domains, of a first number L to a second number M of subband components. After determining a third number K, least common multiple between the first number L and the second number M: a) if K is different from L, it consists ...

Belgacem Haba Belgacem (Bel) Haba
Wael Zohni, Belgacem Haba: Stacked chip-on-board module with edge connector. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 21, 2014: US08633576 (9 worldwide citation)

A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second ...

Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, January 14, 2014: US08629545 (29 worldwide citation)

A system or microelectronic assembly can include one or more microelectronic packages each having a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may ...