1
Guoxiao Guo Guoxiao Guo
Guoxiao Guo, Jie Yu: Disk drive biasing sync pattern of an extended sync mark. Western Digital Technologies, December 31, 2013: US08619385 (98 worldwide citation)

A disk drive is disclosed comprising a disk including a plurality of sectors each comprising a sector sync mark pattern and sector data preceding and following the sector sync mark pattern, and a head actuated over the disk for generating a read signal. A data sequence is detected from the read sign ...


2
James Kraemer Ph.D.
Samuel S Adams, Robert R Friedlander, James R Kraemer: Dimensionally constrained synthetic context objects database. International Business Machines Corporation, John R Pivnichny, Law Office of Jim Boice, December 31, 2013: US08620958 (21 worldwide citation)

A processor-implemented method, system, and/or computer program product generate and utilize a dimensionally constrained hierarchical synthetic context-based object library for multiple synthetic context-based objects. A non-contextual data object is associated with a context object to define a synt ...


3
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 31, 2013: US08618659 (24 worldwide citation)

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


4
James Kraemer Ph.D.
Robert R Friedlander, James R Kraemer: Allocating research funding. International Business Machines Corporation, John R Pivnichny, Law Office of Jim Boice, December 31, 2013: US08620804

Allocation of research funding is based on changes to sizes of resource clusters. Each resource cluster is composed of a set of researchers devoted to a single aspect of a research field. A size change to a specific resource cluster indicates a change to a level of activities associated with a corre ...


5
Ugochukwu Njoku
Anthony F Coneski, David Craddock, Charles W Gainey Jr, Beth A Glendening, Thomas A Gregg, Ugochukwu C Njoku: Discovery by operating system of information relating to adapter functions accessible to the operating system. International Business Machines Corporation, John E Campbell, Blanche E Schiller Esq, Heslin Rothenberg Farley & Mesiti P C, December 31, 2013: US08621112 (2 worldwide citation)

A tiered discovery capability is employed to obtain attributes regarding adapters of an I/O configuration. The first tier obtains a list of the adapter functions accessible to an operating system; the second tier obtains attributes regarding a selected adapter function of the list of adapter functio ...


6
Katherina Babich
Marie Angelopoulos, Katherina E Babich, Sean D Burns, Allen H Gabor, Scott D Halle, Arpan P Mahorowala, Dirk Pfeiffer: Process of making a lithographic structure using antireflective materials. International Business Machines Corporation, Novak Druce Connolly Bove Quigg, Louis J Percello Esq, December 17, 2013: US08609322

A lithographic structure comprising: an organic antireflective material disposed on a substrate, and a silicon antireflective material disposed on the organic antireflective material. The silicon antireflective material comprises a crosslinked polymer with a SiOx backbone, a chromophore, and a trans ...


7
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610260 (21 worldwide citation)

A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and c ...


8
Belgacem Haba Belgacem (Bel) Haba
Cyprian Uzoh, Belgacem Haba, Craig Mitchell: Reliable packaging and interconnect structures. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08609540 (1 worldwide citation)

Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure co ...


9
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Compliant interconnects in wafers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610264 (1 worldwide citation)

A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. ...


10
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Multi-function and shielded 3D interconnects. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610259 (3 worldwide citation)

A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening ext ...



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