1
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610260 (25 worldwide citation)

A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and c ...


2
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Multi-function and shielded 3D interconnects. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610259 (5 worldwide citation)

A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening ext ...


3
Belgacem Haba Belgacem (Bel) Haba
Cyprian Uzoh, Belgacem Haba, Craig Mitchell: Reliable packaging and interconnect structures. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08609540 (1 worldwide citation)

Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure co ...


4
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Compliant interconnects in wafers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610264 (1 worldwide citation)

A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. ...


5
Katherina Babich
Marie Angelopoulos, Katherina E Babich, Sean D Burns, Allen H Gabor, Scott D Halle, Arpan P Mahorowala, Dirk Pfeiffer: Process of making a lithographic structure using antireflective materials. International Business Machines Corporation, Novak Druce Connolly Bove Quigg, Louis J Percello Esq, December 17, 2013: US08609322

A lithographic structure comprising: an organic antireflective material disposed on a substrate, and a silicon antireflective material disposed on the organic antireflective material. The silicon antireflective material comprises a crosslinked polymer with a SiOx backbone, a chromophore, and a trans ...


6
Sagy Pundak Mintz
Alexander D Deitz, Sagy P Mintz: System and method for management and analysis of electronic trade orders. Trading Technologies International, McDonnell Boehnen Hulbert & Berghoff, December 17, 2013: US08612335

A system and methods are provided for using order descriptor identifiers in relation to orders being used in trading strategies. According to one example method, when a hedge order is submitted upon detecting a fill of another order, the hedge order includes one or more order descriptor identifiers ...


7
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Robert M Rassel, Anthony K Stamper: Method of forming MIM capacitor structure in FEOL. International Business Machines Corporation, David A Cain, Hoffman Warnick, December 17, 2013: US08609505

A capacitor structure includes a semiconductor substrate; a first capacitor plate positioned on the semiconductor substrate, the first capacitor plate including a polysilicon structure having a surrounding spacer; a silicide layer formed in a first portion of an upper surface of the first capacitor ...


8
Abdellatif Benjelloun Touimi
Adil Mouhssine, Abdellatif Benjelloun Touimi, Pierre Duhamel: Quantization after linear transformation combining the audio signals of a sound scene, and related coder. France Telecom, Drinker Biddle & Reath, December 17, 2013: US08612220

The invention relates to a method for quantifying components, wherein certain components are each determined based on a plurality of audio signals and can be calculated by the application of a linear conversion on the audio signals, said method comprising: determining a quantification function to be ...


9
Michael Barrington Wood
PIVAC MARK JOSEPH, WOOD MICHAEL BARRINGTON: SYSTEME AUTOMATISE DE POSE DE BRIQUES POUR CONSTRUIRE UN BATIMENT A PARTIR DUNE PLURALITE DE BRIQUES, AN AUTOMATED BRICK LAYING SYSTEM FOR CONSTRUCTING A BUILDING FROM A PLURALITY OF BRICKS. GOLDWING NOMINEES, GOLDWING NOMINEES, RICHES MCKENZIE & HERBERT, December 17, 2013: CA2633733

An automated brick laying system 10 for constructing a building from a plurality of bricks 16 comprises a robot 12 provided with a brick laying and adhesive applying head 18, a measuring system 13, and a controller 14 that provides control data to the robot 12 to lay the bricks 16 at predetermined l ...


10
Chao Bi
Quan Jiang, Chao Bi, Song Lin: Runout measurement for devices having a rotating body. Agency for Science Technology and Research, Blakely Sokoloff Taylor & Zafman, December 17, 2013: US08610392

A runout measurement system is proposed for measuring the runout of a moving surface of a device having a rotating body, such as a mass storage device (100) (e.g. a hard disk drive) having a rotor which in use includes a rotating recording medium. A sensor (102) interacting with the moving surface o ...



Click the thumbnails below to visualize the patent trend.