1
Private Ugochukwu Njoku
John R Flanagan, Daniel F Casper, Matthew J Kalos, Dale F Riedy, Gustav E Sittmann, Ugochukwu C Njoku, Catherine C Huang: Providing indirect data addressing for a control block at a channel subsystem of an I/O processing system. International Business Machines Corporation, Cantor Colburn, John Campbell, August 20, 2013: US08516161

An computer program product, apparatus, and method for facilitating input/output (I/O) processing for an I/O operation at a host computer system configured for communication with a control unit. The computer program product includes a tangible storage medium readable by a processing circuit and stor ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Memory module in a package. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513817 (32 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the sub ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513813 (25 worldwide citation)

A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian: Edge connect wafer level stacking with leads extending along edges. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513789 (2 worldwide citation)

A method of making a stacked microelectronic package by forming a microelectronic assembly by stacking a first subassembly including a plurality of microelectronic elements onto a second subassembly including a plurality of microelectronic elements, at least some of the plurality of microelectronic ...


5
Bo LIU
Yansheng Ma, Bo Liu, Leonard Gonzaga: Hard disk drive slider. Agency for Science Technology and Research, Conley Rose P C, August 20, 2013: US08514521 (1 worldwide citation)

A hard disk drive system is provided. The hard disk drive system includes a hard disk and at least one slider structure for reading data from and writing data onto the hard disk. The hard disk includes a plurality of layers, and at least a topmost one of the plurality of layers comprises a lubricant ...


6
Charles Szmanda
Kevin Calzia, David Mosley, Charles R Szmanda: Dichalcogenide selenium ink and methods of making and using same. Rohm and Haas Electronic Materials, Thomas S Deibert, August 20, 2013: US08513052

A method for preparing a Group 1a-1b-3a-6a material using a selenium ink comprising a chemical compound having a formula RZ—Sex—Z′R′ stably dispersed in a liquid carrier is provided, wherein the selenium ink is hydrazine free and hydrazinium free.


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed: Stacked assembly including plurality of stacked microelectronic elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513794

A method is provided for fabricating a stacked microelectronic assembly by steps including stacking and joining first and second like microelectronic substrates, each including a plurality of like microelectronic elements attached together at dicing lanes. Each microelectronic element has boundaries ...


8
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Dual wafer spin coating. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08512491

A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not co ...


9
Longzhi Jiang
Mark Derakhshan, William Einziger, Longzhi Jiang, Timothy Wise, Venkata Krishnan Veeraraghavan Narayanan, Charles Helms, Charles Dudley Yarborough: Suspension system and method for suspending an inner vessel inside an outer vessel of a cryostat. General Electric Company, The Small Patent Law Group, Dean D Small, August 20, 2013: US08511632

A suspension system for a cryostat includes a coupling mechanism, a fixation body, and a pin. The coupling mechanism is joined to an outer vessel and coupled with a strap. The fixation body is joined to an inner vessel. The fixation body extends between a front side that faces the coupling mechanism ...


10
Sharat Batra, Ut Tran, Zhigang Bai, Kevin K Lin: Systems and methods for providing hybrid coils for magnetic write heads. Western Digital, August 20, 2013: US08514517 (125 worldwide citation)

Systems and methods for providing hybrid coils for magnetic write heads used in disk drives are described. One such system includes a magnetic read/write head including a read transducer, and a write transducer including a pair of write poles, a hybrid coil including a first coil having a pancake co ...



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