1
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: De-skewed multi-die packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2013: US08502390 (24 worldwide citation)

A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connecti ...


2
Ugochukwu Njoku
David Craddock, Charles W Gainey Jr, Beth A Glendening, Thomas A Gregg, Ugochukwu C Njoku: Operating system notification of actions to be taken responsive to adapter events. International Business Machines Corporation, John E Campbell, Blanche E Schiller Esq, Heslin Rothenberg Farley & Mesiti P C, August 6, 2013: US08505032 (12 worldwide citation)

Notification of hardware actions to be taken responsive to hardware events is facilitated. An operating system coupled, but external to, the hardware notifies firmware of the hardware action to be taken.


3
Bahman Qawami
Fabrice Jogand Coulomb, Michael Holtzman, Bahman Qawami, Ron Barzilai, Hagai Bar El: Method for versatile content control. SanDisk Technologies, Discretix Technologies, Brinks Hofer Gilson & Lione, August 6, 2013: US08504849 (9 worldwide citation)

Many storage devices are not aware of file systems while many computer host devices read and write data in the form of files. The host device provides a key reference or ID, while the memory system generates a key value in response which is associated with the key ID, which is used as the handle thr ...


4
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia: High density three-dimensional integrated capacitors. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2013: US08502340

A component includes a substrate and a capacitor formed in contact with the substrate. The substrate can consist essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C. The substrate can have a surface and an opening extending downwardly therefrom. The capacitor ...


5
sally liu
Hsiao Tsung Yen, Hsien Pin Hu, Chin Wei Kuo, Sally Liu: Through-substrate via waveguides. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, August 6, 2013: US08502338 (6 worldwide citation)

A device includes a semiconductor substrate of a first conductivity type, wherein the semiconductor substrate comprises a first surface and a second surface opposite the first surface. A through-substrate via (TSV) extends from the first surface to the second surface of the semiconductor substrate. ...


6
sally liu
Jhe Ching Lu, Hsiao Tsung Yen, Sally Liu, Tzu Jin Yeh, Min Chie Jeng: Balun system and method. Taiwan Semiconductor Maufacturing Company, Slater & Matsil L, August 6, 2013: US08502620 (4 worldwide citation)

A system and method for transmitting signals is disclosed. An embodiment comprises a balun, such as a Marchand balun, which has a first transformer with a primary coil and a first secondary coil and a second transformer with the primary coil and a second secondary coil. The first secondary coil and ...


7
Sumit Agarwal
Sumit Agarwal, Vic Gundotra, Alex Nicolaou: Providing results to parameterless search queries. Google, Shumaker & Sieffert P A, August 6, 2013: US08504286 (2 worldwide citation)

In one implementation, a computer-implemented method includes receiving a parameterless search request, which was provided to a mobile computing device, for information that is relevant to a user of the mobile computing device. The method also includes, in response to the received parameterless sear ...


8
Charles Sperry
Charles R Sperry, Suzanne M Scott, Dennis F McNamara Jr, Vincent A Piucci Jr, Michael J Schamel: Method for making foam-in-place cushions with selective distribution of foam. Sealed Air Corporation, Alston & Bird, August 6, 2013: US08501061 (1 worldwide citation)

A method for making a foam-in-place cushion in which a foam-forming composition is dispensed between two plastic film portions in a predetermined fashion to selectively control the distribution of the foam in the cushion. A foam dispenser can be moved in a transverse direction as foam is dispensed. ...


9
Steven Jobs
Steven P Jobs, Donald J Lindsay: Computer interface having a single window mode of operation. Apple, Schwegman Lundberg & Woessner P A, August 6, 2013: US08504937 (1 worldwide citation)

A computer-human interface manages the available space of a computer display in a manner which reduces clutter and confusion caused by multiple open windows. The interface includes a user-selectable mode of operation in which only those windows associated with the currently active task are displayed ...


10
Artie Chin
Nathan Tait Allen, Robert Butterick III, Arthur Achhing Chin, Dean Michael Millar, David Craig Molzahn: Process for production of an aluminum hydride compound. Rohm and Haas Company, Dow Global Technologies, Kenneth Crimaldi, August 6, 2013: US08501137

A compound of formula M(AlH3OR1)y, wherein R1 is phenyl substituted by at least one of: (i) an alkoxy group having from one to six carbon atoms; and (ii) an alkyl group having from three to twelve carbon atoms; wherein M is an alkali metal, Be or Mg; and y is one or two.



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