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Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436477 (34 worldwide citation)

A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element c ...


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Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436457 (30 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of termina ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard Dewitt Crisp, Wael Zohni: Flip-chip, face-up and face-down wirebond combination package. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436458 (4 worldwide citation)

A microelectronic assembly can include a substrate having oppositely-facing first and second surfaces and a first aperture extending between the first and second surfaces, a first microelectronic element having a surface facing the first surface, a second microelectronic element having a front surfa ...


4
Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, Keith E Downes, Ebenezer E Eshun, Zhong Xiang He, Robert M Rassel, Anthony K Stamper: Process for single and multiple level metal-insulator-metal integration with a single mask. International Business Machines Corporation, Anthony Canale, Roberts Mlotkowski Safran & Cole P C, May 7, 2013: US08435864

A method of fabricating a MIM capacitor is provided. The method includes providing a substrate including a dielectric layer formed on a first conductive layer and a second conductive layer formed over the dielectric layer, and patterning a mask on the second conductive layer. Exposed portions of the ...


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Eugene Fitzgerald
Minjoo L Lee, Christopher W Leitz, Eugene A Fitzgerald: Structure and method for a high-speed semiconductor device having a Ge channel layer. Massachusetts Institute of Technology, Goodwin Procter, May 7, 2013: US08436336

The invention provides semiconductor structure comprising a strained Ge channel layer, and a gate dielectric disposed over the strained Ge channel layer. In one aspect of the invention, a strained Ge channel MOSFET is provided. The strained Ge channel MOSFET includes a relaxed SiGe virtual substrate ...


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Cristiano Dalvi, Marcelo Lamego, Sean Merritt, Hung Vo, Johannes Bruinsma, Jeroen Poeze, Ferdyan Lesmana, Greg Olsen, Massi Joe E Kiani: Contoured protrusion for improving spectroscopic measurement of blood constituents. Cercacor Laboratories, Knobbe Martens Olson & Bear, May 7, 2013: US08437825 (131 worldwide citation)

A noninvasive physiological sensor for measuring one or more physiological parameters of a medical patient can include a bump interposed between a light source and a photodetector. The bump can be placed in contact with body tissue of a patient and thereby reduce a thickness of the body tissue. As a ...


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Amar N Ray, Cadathur V Chakravarthy: System and method for providing contact information of a mobile device to a reverse 911 database. CenturyLink Intellectual Property, Swanson & Bratschun L L C, May 7, 2013: US08437734 (123 worldwide citation)

In one embodiment, when a mobile device is powered on, a mobile switching center acquires the contact information, such as, but not limited to, a phone number and the physical location associated with the mobile device. If the mobile device is a new device to the area, the contact information of the ...


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Jing Tang, Nitin Ingle, Dongqing Yang, Shankar Venkataraman: Invertable pattern loading with dry etch. Applied Materials, Kilpatrick Townsend & Stockton, May 7, 2013: US08435902 (120 worldwide citation)

A method of etching silicon oxide from a narrow trench and a wide trench (or open area) is described which allows the etch in the wide trench to progress further than the etch in the narrow trench. The method includes two dry etch cycles. The first dry etch cycle involves a low intensity or abbrevia ...