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Fred Thomas Fred Thomas
Fred Charles Thomas III, Bryce Carl Wemple, Charles Shilling, Allen O Buckner: Interface adapter systems and methods. Hewlett Packard Development Company, Michael Czarnecki, February 26, 2013: US08386689

Interface adapter systems and methods are provided. An adapter means can be provided for coupling a first interface to a second interface, the second interface configured to accommodate the coupling of a peripheral device. A detector means can be provided for detecting the peripheral device. A means ...


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Vincent Le Chevalier Vincent Le Chevalier
Brady Duga, John Rivlin, Vincent Le Chevalier, Garth Conboy: System for and method of displaying non-rectangular images in electronic content on a reader device. Hunton & Williams, February 26, 2013: US08385659 (1 worldwide citation)

A system for and method of displaying non-rectangular images in electronic content on an electronic device in accordance with exemplary embodiments may include identifying, using a template identification computing apparatus, an image shape template associated with a non-rectangular image that is pa ...


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Ivo Koutsaroff 掘露 伊保龍
YAMAMOTO KANSHO, YAMAMOTO TEIJI, KOUTSAROFF P IVO: [fr] ACTIONNEUR PIÉZO-ÉLECTRIQUE ET SON PROCÉDÉ DE FABRICATION, [de] PIEZOELEKTRISCHER AKTUATOR UND HERSTELLUNGSVERFAHREN FÜR DEN PIEZOELEKTRISCHEN AKTUATOR, [en] PIEZOELECTRIC ACTUATOR AND MANUFACTURING METHOD FOR PIEZOELECTRIC ACTUATOR. MURATA MANUFACTURING CO, February 27, 2013: EP2562836-A1

[en] A piezoelectric actuator is realized which can be formed by means of a simpler configuration and a simpler manufacturing flow than in the related art. A fixed electrode (12) is formed in a base substrate (11). A dielectric layer (13) is formed on the surface of the base substrate (11). A lower ...


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Deodatta Shenai-Khatkhate
DIXIT RAVINDRA S, BAI HUA, MODTLAND CURTIS D, WARE ROBERT A, PENDERGAST JR JOHN G, CHRISTENSON CHRISTOPHER P, SHENAI KHATKHATE DEODATTA VINAYAK, AMAMCHYAN ARTASHES, CROUCH KENNETH M, POLCARI ROBERT F: [fr] Préparation de composés organométalliques, [de] Organometallische Verbindungszubereitung, [en] Organometallic compound preparation. ROHM & HAAS ELECT MATERIALS, Dow Global Technologies, February 20, 2013: EP2559682-A2

[en] A method of continuously manufacturing organometallic compounds is provided where two or more reactants are conveyed to a reactor having a laminar flow contacting zone, a heat transfer zone, and a mixing zone having a turbulence-promoting device. and causing the reactants to form the organometa ...


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Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Belgacem Haba, Guilian Gao: Wafer level chip package and a method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2013: US08378487

Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.


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Belgacem Haba Belgacem (Bel) Haba
Kishor Desai, Belgacem Haba, Wael Zohni: Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2013: US08378478 (38 worldwide citation)

The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelec ...


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Sagy Pundak Mintz
Michael L Fishbain, Sagy P Mintz, Stephen J Murphy: System and method for timed order entry and modification. Trading Technologies International, McDonnell Boehnen Hulbert & Berghoff, February 19, 2013: US08380606

A system and method for defining and processing timed orders are defined. According to one embodiment, a trader may define a timed order by defining an intra-day time trigger or a time period when the timed order should be automatically modified, such as deleted or cancelled/replaced with a new orde ...


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Belgacem Haba Belgacem (Bel) Haba
Thomas F Fox, Sayeh Khalili, Belgacem Haba, David Nguyen, Richard Warmke, Xingchao Yuan: Stacked semiconductor module. Rambus, Morgan Lewis & Bockius, February 19, 2013: USRE044019

The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrat ...



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