1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp: Impedence controlled packages with metal sheet or 2-layer rdl. Tessera, December 13, 2012: US20120313228-A1

A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact ther ...


2
James Kraemer Ph.D.
Robert R Friedlander, James R Kraemer: Cohort driven selection of a course of medical treatment. International Business Machines Corporation, December 13, 2012: US20120316891-A1

A computer implemented method, system, and/or computer program product create a recommended course of medical treatment of a current patient. A current medical diagnosis of a medical condition being suffered by the current patient is used to identify a cohort of other persons who have been diagnosed ...


3
James Kraemer Ph.D.
Robert R Friedlander, James R Kraemer: Cohort driven selection of medical diagnostic tests. International Business Machines Corporation, December 13, 2012: US20120317127-A1

A computer implemented method, system, and/or computer program product create a suggested diagnostic test selection. A description of a current patient includes a current medical complaint, medical history, and physical examination result for the current patient. A cohort for the current patient is ...


4
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip package assembly and method for making same. Tessera Research, December 13, 2012: US20120313238-A1

A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the secon ...


5
Belgacem Haba Belgacem (Bel) Haba
Kazuo Sakuma, Philip Damberg, Belgacem Haba: Substrate and assembly thereof with dielectric removal for increased post height. Tessera, December 13, 2012: US20120313242-A1

An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, ex ...


6
Belgacem Haba Belgacem (Bel) Haba
Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg, Hiroaki Sato, Kiyoaki Hashimoto: Fan-out wlp with package. c o Tessera, December 13, 2012: US20120313253-A1

A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces ...


7
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Chip with sintered connections to package. Teresa, December 13, 2012: US20120313264-A1

A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge su ...


8
DOLE William P: UTILISATION DANTAGONISTES DE PCSK9, USE OF PCSK9 ANTAGONISTS. Novartis, DOLE William P, MATOVCIK Lisa M, December 13, 2012: WO/2012/170607 (69 worldwide citation)

The present invention provides the therapetic use in patients eligible for apheresis of antibody antagonists against proprotein convertase subtilisin/kexin type 9a ("PCSK9").


9
SCHATZ David A, KESLER Morris P, HALL Katherine L, GANEM Steven J: TRANSFERT D√ČNERGIE SANS FIL POUR DISPOSITIFS IMPLANTABLES, WIRELESS ENERGY TRANSFER FOR IMPLANTABLE DEVICES. WITRICITY CORPORATION, SCHATZ David A, KESLER Morris P, HALL Katherine L, GANEM Steven J, MONOCELLO John A III, December 13, 2012: WO/2012/170278 (69 worldwide citation)

Described herein are improved configurations for a wireless power transfer. Described are methods and designs for implantable electronics and devices. Wireless energy transfer is utilized to eliminate cords and power cables puncturing the skin to power an implantable device. Repeater resonators are ...


10
GIFFARD Marion: FORMULATIONS PHARMACEUTIQUES DANTAGONISTES DE PCSK9, PHARMACEUTICAL FORMULATIONS OF PCSK9 ANTAGONISTS. Novartis, GIFFARD Marion, WESTBERG Suzanne, December 13, 2012: WO/2012/168491 (68 worldwide citation)

The present invention provides pharmaceutical formulations comprising antibody antagonists against proprotein convertase subtilisin/kexin type 9a ("PCSK9").



Click the thumbnails below to visualize the patent trend.