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Dr Raj C Thiagarajan ATOA Scientific Technologies Dr Raj C Thiagarajan ATOA Scientific Technologies
Chinniah Thiagarajan, Bernd Jansen, Santhosh Kumar Rajendran, Vauhini RM, Safwat E Tadros: Siloxane block copolymer nanoporous foams, methods of manufacture thereof and articles comprising the same. Sabic Innovative Plastics IP, Cantor Colburn, October 9, 2012: US08283390

Disclosed herein is a foam that includes a polysiloxane block copolymer; the polysiloxane block copolymer including a first block that comprises a polysiloxane block and a second block that includes an organic polymer; the second block not containing a polysiloxane; the polysiloxane block being abou ...


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Yimin DING
Huo Junjie, Tai Xiaopeng, Huang Jinhuang, Ding Yimin, Song Yi: Multi-protocol self-adaption selection circuit used for non-contact type smart card. Beijing Tongfang Microelectronics, October 31, 2012: CN201110106801

A multi-protocol self-adaption selection circuit used for a non-contact type smart card belongs to the technical field of a non-contact type smart card. According to the multi-protocol self-adaption selection circuit, a resonant circuit is respectively connected with a demodulator and decoder with a ...


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James Kraemer Ph.D.
Robert Lee Angell, Robert R Friedlander, James R Kraemer: Identifying and generating audio cohorts based on audio data input. International Business Machines Corporation, John R Pivnichny, Law Office of Jim Boice, October 30, 2012: US08301443 (4 worldwide citation)

A computer implemented method, apparatus, and computer program product for generating audio cohorts. An audio analysis engine receives audio data from a set of audio input devices. The audio data is associated with a plurality of objects. The audio data comprises a set of audio patterns. The audio d ...


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Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Sean Moran, Wei Shun Wang, Ellis Chau, Christopher Wade: Microelectronic package. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 30, 2012: US08299626 (3 worldwide citation)

A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features ...


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Belgacem Haba Belgacem (Bel) Haba
Wael Zohni, Belgacem Haba: Stacked chip-on-board module with edge connector. Tessera, October 25, 2012: US20120267771-A1

A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard Dewitt Crisp, Wael Zohni: Flip-chip, face-up and face-down wirebond combination package. Tessera, October 25, 2012: US20120267797-A1

A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard Dewitt Crisp, Wael Zohni: Flip-chip, face-up and face-down centerbond memory wirebond assemblies. Tessera, October 25, 2012: US20120267796-A1

A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microel ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Multiple die face-down stacking for two or more die. Tessera, October 25, 2012: US20120267798-A1

A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned w ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Piyush Savalia: Multi-chip module with stacked face-down connected dies. Tessera Research, October 25, 2012: US20120267777-A1

A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate ...


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Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Cyprian Uzoh, Piyush Savalia: Vias in porous substrates. Tessera Research, October 25, 2012: US20120267789-A1

A microelectronic unit can include a substrate having front and rear surfaces and active semiconductor devices therein, the substrate having a plurality of openings arranged in a symmetric or asymmetric distribution across an area of the rear surface, first and second conductive vias connected to fi ...



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