1
Belgacem Haba Belgacem (Bel) Haba
Wael Zohni, Belgacem Haba: Stacked chip-on-board module with edge connector. Tessera, October 25, 2012: US20120267771-A1

A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard Dewitt Crisp, Wael Zohni: Flip-chip, face-up and face-down wirebond combination package. Tessera, October 25, 2012: US20120267797-A1

A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard Dewitt Crisp, Wael Zohni: Flip-chip, face-up and face-down centerbond memory wirebond assemblies. Tessera, October 25, 2012: US20120267796-A1

A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microel ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Multiple die face-down stacking for two or more die. Tessera, October 25, 2012: US20120267798-A1

A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned w ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Piyush Savalia: Multi-chip module with stacked face-down connected dies. Tessera Research, October 25, 2012: US20120267777-A1

A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate ...


6
Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Cyprian Uzoh, Piyush Savalia: Vias in porous substrates. Tessera Research, October 25, 2012: US20120267789-A1

A microelectronic unit can include a substrate having front and rear surfaces and active semiconductor devices therein, the substrate having a plurality of openings arranged in a symmetric or asymmetric distribution across an area of the rear surface, first and second conductive vias connected to fi ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang: Reinforced fan-out wafer-level package. Tessera Research, October 25, 2012: US20120268899-A1

A microelectronic package includes a microelectronic element including a first surface having contacts thereon, a second surface remote therefrom, and edge surfaces extending between the first and second surfaces. A reinforcing layer adheres to the at least one edge surface and extends in a directio ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed: Interposer having molded low cte dielectric. Tessera Research, October 25, 2012: US20120267751-A1

A method for making an interconnection component is disclosed, including forming a plurality of metal posts extending away from a reference surface. Each post is formed having a pair of opposed end surface and an edge surface extending therebetween. A dielectric layer is formed contacting the edge s ...


9
Stanley B Solomon: Inventory control system process. Worthwhile Products, October 25, 2012: US20120271742-A1

The inventory control system process includes storing product information in a database. Location information is also accepted and stored in the database in association with the product information. The system receives a command associated with the database and analyzes the command for an instructio ...


10
Hong Zhao, Kyoo Chul Park, Kock Yee Law: Ink jet print head front face having a textured superoleophobic surface and methods for making the same. Xerox Corporation, October 25, 2012: US20120268524-A1

An ink jet print head front face or nozzle plate having a textured superoleophobic surface that prevents undesirable drooling, wetting and/or adhesion of the ink on the print head. The textured surface includes a rim formed around the nozzle. Also described are methods for forming the textured super ...



Click the thumbnails below to visualize the patent trend.