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Dr Raj C Thiagarajan ATOA Scientific Technologies Dr Raj C Thiagarajan ATOA Scientific Technologies
Chinniah Thiagarajan, Frans Adriaansen, Bhawesh Kumar: Apparatus for connecting panels. Sabic Innovative Plastics IP, Cantor Colburn, June 5, 2012: US08191329 (1 worldwide citation)

Disclosed herein are connectors for panels. In one embodiment a panel connector comprises, a connector comprising a rib-hinging geometry, wherein the rib-hinging geometry comprises living hinges, and wherein the rib-hinging geometry is capable of expanding in area. In another embodiment, a panel ass ...


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David Mosley
Peter A Carr, Brian Y Chow, Joseph M Jacobson, David W Mosley, Christopher Emig: Methods for high fidelity production of long nucleic acid molecules. Massachusetts Institute of Technology, Norma E Henderson, June 26, 2012: US08206952 (5 worldwide citation)

In a method for synthesizing a long nucleic acid molecule, a first immobilized nucleic acid has a first 5′ region and a first 3′ region and a second immobilized nucleic acid has a second 5′ region and a second 3′ region. The second 3′ region and the first 5′ region have identical nucleic acid sequen ...


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Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, Keith E Downes, Ebenezer E Eshun, Zhong Xiang He, Robert M Rassel, Anthony K Stamper: Process for single and multiple level metal-insulator-metal integration with a single mask. International Business Machines Corporation, Anthony Canale, Roberts Mlotkowski Safran & Cole P C, June 26, 2012: US08207568 (1 worldwide citation)

Method of fabricating a MIM capacitor and MIM capacitor. The method includes providing a substrate including a dielectric layer formed on a first conductive layer and a second conductive layer formed over the dielectric layer, and patterning a mask on the second conductive layer. Exposed portions of ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Giles Humpston, Jae M Park: Microelectronic package comprising offset conductive posts on compliant layer. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 26, 2012: US08207604 (28 worldwide citation)

A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from t ...


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Jens Nagel
Heiko K Sacher, Maria E Romera, Jens Nagel: Electronic device and user interface and input method therefor. June 21, 2012: US20120159390-A1

A portable electronic device (100,400) and user interface (425) are operated using a method including initiating entry of a content string; determining the most probable completion alternative or a content prediction using a personalized and learning database (430); displaying the most probable comp ...


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Ravi Laxman
John N Gregg, Scott L Battle, Jeffrey I Banton, Donn K Naito, Ravi Laxman: Method and apparatus to help promote contact of gas with vaporized material. Advanced Technology Materials, June 21, 2012: US20120153048-A1

Vaporizable material is supported within a vessel to promote contact of an introduced gas with the vaporizable material, and produce a product gas including vaporized material. A heating element supplies heat to a wall of the vessel to heat vaporizable material disposed therein. The vessel may compr ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution. Tessera, June 21, 2012: US20120153435-A1

A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielect ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution. Tessera, June 21, 2012: US20120155042-A1

A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrica ...


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Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Wei Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip assembly and method for making same. Tessera, June 21, 2012: US20120155055-A1

A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid di ...



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