1
Private Ugochukwu Njoku
John R Flanagan, Daniel F Casper, Matthew J Kalos, Dale F Riedy, Gustav E Sittmann, Ugochukwu C Njoku, Catherine C Huang: Providing indirect data addressing for a control block at a channel subsystem of an i/o processing system. International Business Machines Corporation, May 10, 2012: US20120117275-A1

An computer program product, apparatus, and method for facilitating input/output (I/O) processing for an I/O operation at a host computer system configured for communication with a control unit. The computer program product includes a tangible storage medium readable by a processing circuit and stor ...


2
Dr Raj C Thiagarajan ATOA Scientific Technologies Dr Raj C Thiagarajan ATOA Scientific Technologies
Thiagarajan Chinniah, Adriaansen Frans: A multiwall sheet, an article, a method of making a multiwall sheet. Sabic Innovative Plastics Ip, wu peishan bian xinqin, May 2, 2012: CN200980143262

Disclosed herein is a multiwall sheet that comprises a first wall, a second wall, an intermediate wall disposed between the first wall and the second wall, a first set of ribs disposed between the first wall and the intermediate wall, and a second set of ribs disposed between the second wall and the ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian: Edge connect wafer level stacking. Tessera, May 31, 2012: US20120133057-A1

A stacked microelectronic assembly includes a first stacked subassembly and a second stacked subassembly overlying a portion of the first stacked subassembly. Each stacked subassembly includes at least a respective first microelectronic element having a face and a respective second microelectronic e ...


4
Eb Eshun
Anil K Chinthakindi, Timothy J Dalton, Ebenezer E Eshun, Jeffrey P Gambino, Anthony K Stamper, Kunal Vaed: Methods of fabricating passive element without planarizing and related semiconductor device. International Business Machines Corporation, May 31, 2012: US20120133022-A1

Methods of fabricating a passive element and a semiconductor device including the passive element are disclosed including the use of a dummy passive element. A dummy passive element is a passive element or wire which is added to the chip layout to aid in planarization but is not used in the active c ...


5
Su Liu
Li Li, Su Liu, Azubuike Victor Onwuta, Aruna Yedavilli: Method to Automatically Display Filenames Encoded in Multiple Code Sets. International Business Machines Corporation, May 31, 2012: US20120137218-A1

A computer implemented method, computer program product, and computer system for viewing content encoded in at least one code set and stored in a file system. A computer identifies a unified code set covering all characters used in the file system. The computer, responsive to a user input to view th ...


6
James Kraemer Ph.D.
Robert Lee Angell, Robert R Friedlander, James R Kraemer: Identifying and generating biometric cohorts based on biometric sensor input. International Business Machines Corporation, John R Pivnichny, Law Office of Jim Boice, May 29, 2012: US08190544

The illustrative embodiments described herein provide a computer implemented method, apparatus, and computer program product for generating biometric cohorts. In one embodiment, biometric data is received which identifies a set of biometric patterns. The biometric data is received from a set of biom ...


7
John Leicester Williams
Joseph G Wyss, Dimitri Sokolov, Jordan S Lee, John L Williams, Said T Gomaa, John M Armacost, Christel M Wagner: Posterior stabilized orthopaedic knee prosthesis having controlled condylar curvature. DePuy Products, Barnes & Thornburg, May 29, 2012: US08187335 (11 worldwide citation)

An orthopaedic knee prosthesis includes a tibial bearing and a femoral component configured to articulate with the tibial bearing. The femoral component includes a posterior cam configured to contact a spine of the tibial bearing and a condyle surface curved in the sagittal plane. The radius of curv ...


8
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Belgacem Haba, Guilian Gao: Wafer level chip package and a method of fabricating thereof. Tessera, May 24, 2012: US20120126407-A1

Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.


9
Marc Lanoiselee
LANOISELEE Marc, CARIOU Laurent: DISPOSITIF DE RECEPTION DE DONNEES, PROCEDE DE RECEPTION, PROGRAMME DORDINATEUR ET SUPPORT DENREGISTREMENT CORRESPONDANTS, DATA RECEPTION DEVICE, AND CORRESPONDING RECEPTION METHOD, COMPUTER PROGRAM, AND RECORDING MEDIUM. France Telecom, LANOISELEE Marc, CARIOU Laurent, FRANCE TELECOM R&D PIV BREVETS, May 24, 2012: WO/2012/066209

The invention relates to a data reception device in a communication network using a plurality of radio frequency channels. At least two adjacent radio frequency channels are concatenated so as to form a concatenated channel. Said device includes: - means for receiving so-called "received" data trans ...


10
Belgacem Haba Belgacem (Bel) Haba
Kishor Desai, Belgacem Haba, Wael Zohni: Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts. Tessera Research, May 24, 2012: US20120126389-A1

The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelec ...



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