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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, November 3, 2011: US20110269272-A1

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic assemblies having compliancy. Tessera, November 3, 2011: US20110266668-A1

A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openin ...


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Su Liu
Su Liu, George F Ramsay III: Opening A Message Catalog File For a Language That Is Not Installed. International Business Machines Corporation, November 3, 2011: US20110270602-A1

A first computer system sends a request to a second computer system. The second computer system determines that the first computer system utilizes a message catalog file that is not installed on the second computer system. As a result, the second computer system sends a catalog request that requests ...


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Erwin Meinders
Maria Peter, Erwin Rinaldo Meinders: Method for forming a multi-level surface on a substrate with areas of different wettability and a semiconductor device having the same. November 3, 2011: US20110266563-A1

The invention relates to a method 10 for forming a multi-level surface on a substrate 2, wherein said surface comprises areas of different wettability, the method comprising the step (A, B) of applying a multi-level stamp to the substrate for forming the multi-level surface, said multi-level stamp h ...


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Shyam Venkataraman
Yuzhuo Li, Harvey Wayne Pinder, Shyam S Venkataraman: Chemical mechanical polishing (cmp) polishing solution with enhanced performance. Basf Se, November 3, 2011: US20110269312-A1

This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the li ...


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LEIST Christian, MEISSNER Petra, SCHMIDT Jörg: Milieu de culture cellulaire amélioré, Improved cell culture medium. Novartis, LEIST Christian, MEISSNER Petra, SCHMIDT Jörg, LEHMEIER Thomas, November 3, 2011: WO/2011/134920 (41 worldwide citation)

The present application describes an optimized medium for growth of mammalian cells as well as polypeptide production. The cell culture medium is characterized by a Sow ratio of sodium to potassium ions, it further relates to the method of producing polypeptides using such cell culture media. Sn ano ...


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JOOSTEN Christoph E, LEIST Christian, SCHMIDT Jörg: Procédé amélioré de culture cellulaire, Improved cell cultivation process. Novartis, JOOSTEN Christoph E, LEIST Christian, SCHMIDT Jörg, LEHMEIER Thomas, November 3, 2011: WO/2011/134919 (40 worldwide citation)

This invention relates to a cell culture process for the production of polypeptides in mammalian CHO cells characterized by one or more temperature and pH shifts which are adjusted in respect to their timing and step size to reduce cell death, increase product yield and improve product quality.


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