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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic Assemblies Having Compliancy and Methods Therefor. Tessera, Tessera, LERNER DAVID et al, September 16, 2010: US20100230812-A1

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, September 16, 2010: US20100232129-A1

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Brian Marcucci: Microelectronic assembly with impedance controlled wirebond and conductive reference element. Tessera Research, Tessera, LERNER DAVID et al, September 16, 2010: US20100230828-A1

A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with t ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Brian Marcucci: Microelectronic assembly with impedance controlled wirebond and reference wirebond. Tessera Research, Tessera, LERNER DAVID et al, September 16, 2010: US20100232128-A1

A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip, connected together with an interconnection element, e.g., substrate, the latter having signal contacts and reference contacts. The reference contacts can be connectable to a source of reference potential such ...


5
Belgacem Haba Belgacem (Bel) Haba
Moshe Kriman, Osher Avsian, Belgacem Haba, Giles Humpston, Dmitri Burshtyn: Stacked microelectronic assemblies having vias extending through bond pads. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, September 16, 2010: US20100230795-A1

A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelec ...


6
Jean-luc Dubois
Jean Luc Dubois: Glycerol Vaporization Method. Arkema France, Hunton & Williams, September 16, 2010: US20100230635-A1

The subject matter of the present invention relates to a vaporization method of aqueous glycerol solutions in a fluidized bed containing an inert solid. The invention provides a method for vaporizing, in a single step, an aqueous glycerol solution and simultaneously eliminating the impurities presen ...


7
Steven Jobs
Rainer Brodersen, Rachel Clare Goldeen, Jeffrey Ma, Mihnea Calin Pacurariu, Thomas Michael Madden, Eric Taylor Seymour, Steven Jobs: Content Abstraction Presentation Along A Multidimensional Path. Apple, Fish & Richardson PC, September 16, 2010: US20100235792-A1

Content abstractions are emerged in to an ingress terminus of a multidimensional path and depth transitioned through the multidimensional path to an egress terminus. The content abstractions are eliminated at the egress terminus.


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yuan xing Lee
Shaohua Yang, Richard Leo Galbraith, Ksenija Lakovic, Yuan Xing Lee, Travis Oenning, Jongseung Park, Hideki Sawaguchi, Bruce A Wilson: Decoding Techniques for Correcting Errors Using Soft Information. Hitachi Global Storage Technologies Netherlands, Steven J Cahill Hitachi Gst, September 16, 2010: US20100235718-A1

Two levels of error correction decoding are performed using first and second level decoders. A composite code formed by combining an inner component code and an outer component code can be used to decode the data and correct any errors. Performing two level decoding using a composite code allows the ...


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DERBAS JUSTIN R: System and method for wireless power transfer in implantable medical devices. NEURDS, Parikh Amol, September 16, 2010: WO/2010/104569 (121 worldwide citation)

A system and method for energy transfer between a transmitting unit and a receiving unit, the transmitting unit having a transmitting antenna circuit having a first resonant frequency and a high quality factor.


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KING MARTIN T: Automatically providing content associated with captured information, such as information captured in real-time. EXBIBLIO, Lawrenz Steven D, September 16, 2010: WO/2010/105245 (99 worldwide citation)

A system and method for automatically providing content associated with captured information is described. In some examples, the system receives input by a user, and automatically provides content or links to content associated with the input. In some examples, the system receives input via text ent ...