Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package element and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 3, 2010: US07767497 (34 worldwide citation)

Microelectronic package elements and packages having dielectric layers and methods of fabricating such elements packages are disclosed. The elements and packages may advantageously be used in microelectronic assemblies having high routing density.

Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, Ebenezer E Eshun, Zhong Xiang He, Jeffrey B Johnson, Jonghae Kim, Jean Oliver Plouchart, Anthony K Stamper: Passive components in the back end of integrated circuits. International Business Machines Corporation, Anthony J Canale, August 3, 2010: US07768055 (10 worldwide citation)

Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical ...

Deodatta Shenai-Khatkhate
Deodatta Vinayak Shenai Khatkhate, Michael Brendan Power: Organometallic compounds. Rohm and Haas Electronic Materials, S Matthew Cairns, August 3, 2010: US07767840 (4 worldwide citation)

Organometallic compounds suitable for use as vapor phase deposition precursors for Group IV metal-containing films are provided. Methods of depositing Group IV metal-containing films using certain organometallic precursors are also provided. Such Group IV metal-containing films are particularly usef ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard Dewitt Crisp, Masud Beroz: Microelectronic package having interconnected redistribution paths. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 3, 2010: US07768117 (2 worldwide citation)

A microelectronic unit has a structure including a microelectronic element such as a semiconductor chip with a first contact disposed remote from the periphery of the structure. The unit further includes first and second redistribution conductive pads disposed near a periphery of the structure and a ...


Marc Van Damme
Marc Van Damme, Joan Vermmersch, Alexander Williamson, Willi Kurt Gries: Method of making a photopolymer printing plate. Agfa Graphics, Keating & Bennett, August 3, 2010: US07767382 (2 worldwide citation)

A method of making a lithographic printing plate comprising the steps of: a) providing a lithographic printing plate precursor comprising (i) a support having a hydrophilic surface or which is provided with a hydrophilic layer, (ii) a photopolymerizable coating on said support, b) image-wise exposin ...

Marc Van Damme
Joan Vermeersch, Marc Van Damme: Method for making a negative-working lithographic printing plate precursor. Agfa Graphics, Keating & Bennett, August 3, 2010: US07767384 (1 worldwide citation)

A method for making a heat-sensitive negative-working lithographic printing plate precursor including the steps of providing a support having a hydrophilic surface or which is provided with a hydrophilic layer, and applying onto the support a coating solution including an infrared absorbing agent, h ...

Edward Krainer
Edward Krainer, Peter Frenkel, Mukund Shah, Perry Reed, David J Sikora: Alkyltin sulfanyl mercaptocarboxylates having terminal thiol groups. Galata Chemicals, Dilworth IP, August 3, 2010: US07767740 (1 worldwide citation)

An alkyltin compound of specified formula which has utility as an excellent stabilizer for a halogen-containing resin. The alkyltin compound has from 1-3 terminal thiol groups.



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