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Mohamed SKIBA Mohamed SKIBA
Skiba Mohamed, Bounoure Frédéric, Lahiani Skiba Malika, Dechelotte Pierre: (Fr) Complexes dinclusion de cysteine, leur preparation et les compositions les contenant, (En) Cysteine inclusion complexes and compositions containing same. Aliscience, In Cyclo, Skiba Mohamed, Bounoure Frédéric, Lahiani Skiba Malika, Dechelotte Pierre, BREDEMA, September 12, 2008: WO/2008/107569

(EN) Inclusion complex or mixture of inclusion complexes based on one or more sulphurated amino acids, derivatives thereof or salts thereof, and on at least one cyclodextrin or derivative(s) thereof.(FR) Complexe d'inclusion ou mélange de complexes d'inclusion à base d'un ou plusieurs acides aminés ...


2
Eric First, M.D.
Eric R First: Stretch mark treatment. Allergan, Claude L Nassif, Stephen Donovan, Martin Voet, September 30, 2008: US07429386 (7 worldwide citation)

Methods for treating stretch marks by local administration of a Clostridial toxin, such as a botulinum toxin, to a patient with a stretch mark.


3
Charles Szmanda
Charles R Szmanda, Kathleen B Spear Alfonso, Lujia Bu: Leveling agents for cast ferroelectric polymer films. Rohm and Haas Electronic Materials, Peter F Corless, Darryl P Frickey, Edwards Angell Palmer & Dodge, September 30, 2008: US07429627

A substituted (meth)acrylic copolymer leveling agent is useful in producing a ferroelectric polymer film that is especially suitable for use in a data processing device. Also disclosed is a a casting composition which includes the leveling agent, a film stack, and a data processing device comprising ...


4
Eb Eshun
Douglas Duane Coolbaugh, Ebenezer E Eshun, Zhong Xiang He, Robert Mark Rassel: Mim capacitor and method of making same. Schmeiser Olsen & Watts, September 25, 2008: US20080232025-A1

A MIM capacitor device and method of making the device. The device includes an upper plate comprising one or more electrically conductive layers, a dielectric block comprising one or more dielectric layers, a lower plate comprising one or more electrically conductive layer; and a spreader plate comp ...


5
Ana Londergan
Ana R Londergan, Bangalore R Natarajan, Evgeni Gousev, James Randolph Webster, David Heald: Mems cavity-coating layers and methods. QUALCOMM Incorporated, Knobbe Martens Olson & Bear, September 25, 2008: US20080231931-A1

Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the lay ...


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Dr Raj C Thiagarajan ATOA Scientific Technologies
Adi Narayana Namburi, Hayagreeva Rao, Chinniah Thiagarajan: Composite material for turbine support structure. General Electric Company, Sutherland Asbill & Brennan, September 25, 2008: US20080233372-A1

A composite material for use in turbine support structures. The composite material may include a first material having a positive coefficient of thermal expansion and a second material having a negative coefficient of thermal expansion, a negative Poisson ratio, or both a negative coefficient of the ...


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Eb Eshun
Anil K Chinthakindi, Timothy J Dalton, Ebenezer E Eshun, Jeffrey P Gambino, Anthony K Stamper, Kunal Vaed: Methods of fabricating passive element without planarizing. International Business Machines Corporation, Lisa U Jaklitsch, Hoffman Warnick & D Alessandro, September 23, 2008: US07427550 (3 worldwide citation)

Methods of fabricating a passive element and a semiconductor device including the passive element are disclosed including the use of a dummy passive element. A dummy passive element is a passive element or wire which is added to the chip layout to aid in planarization but is not used in the active c ...


9
Eb Eshun
Ebenezer E Eshun, Steven H Voldman: High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature. International Business Machines Corporation, Scully Scott Murphy & Presser P C, Anthony J Canale, September 23, 2008: US07427551

A resistor device structure and method of manufacture therefore, wherein the resistor device structure invention includes a plurality of alternating conductive film and insulative film layers, at least two of the conductive film layers being electrically connected in parallel to provide for high cur ...


10
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Components with conductive solder mask layers. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 23, 2008: US07427423 (13 worldwide citation)

A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overl ...



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