Katherina Babich
Katherina E Babich, Bruce B Doris, David R Medeiros, Devendra K Sadana: Method for tuning epitaxial growth by interfacial doping and structure including same. International Business Machines Corporation, Scully Scott Murphy & Presser PC, June 26, 2008: US20080153270-A1

A method that allows for uniform, simultaneous epitaxial growth of a semiconductor material on dissimilarly doped semiconductor surfaces (n-type and p-type) that does not impart substrate thinning via a novel surface preparation scheme, as well as a structure that results from the implementation of ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed: Enabling uniformity of stacking process through bumpers. Tessera, Tessera, LERNER DAVID et al, June 26, 2008: US20080150113-A1

A stacked semiconductor chip assembly is disclosed, as are different embodiments relating to same. The stacked chip assembly preferably includes a plurality of units which include a substrate with microelectronic components mounted on each. The individual units desirably are thin and directly abut o ...

Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, June 26, 2008: US20080150121-A1

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...

Belgacem Haba Belgacem (Bel) Haba
Charles White, Belgacem Haba: Microelectronic packages having improved input/output connections and methods therefor. Tessera, Tessera, LERNER DAVID et al, June 26, 2008: US20080150101-A1

A microelectronic assembly includes a microelectronic package, such as a semiconductor package, having a plurality of conductive posts projecting from an exposed surface thereof. The assembly includes a microelectronic element, such as a dielectric film having a first surface and an array of contact ...

Erwin Meinders
Erwin Rinaldo Meinders, Hinke Sijvert Petronella Bouwmans, Julien Jean Xavier De Loynes De Fumichon, Patrick Godefridus Jacobus Maria Peeters: Methods For Mastering And Mastering Substrate. Koninklijke Philips Electronics, Philips Intellectual Property & Standards, June 26, 2008: US20080152936-A1

The present invention relates to a method for providing a high density relief structure in a recording stack (10) of a master substrate (12), particularly a master substrate (12) for making a stamper for the mass-fabrication of optical discs or a master substrate for creating a stamp for micro conta ...

Sagy Pundak Mintz
Burns Michael J, Mintz Sagy P, Herz Eric M, Deitz Alexander D: Order placement in an electronic trading environment. Trading Tech Int, June 25, 2008: EP1934922-A2

A system and associated methods are provided for intelligent placement and movement of orders in an electronic trading environment. According to one example method, in addition to submitting a leg order at a calculated price level, additional orders, queue holder orders, are submitted for the leg or ...

Bahman Qawami
Qawami Bahman, Jagond Coulomb Fabrice, Sabet Sharghi Farshid, Holtzman Michael, Caillon Pascal, Dwyer Patricia, Mcavoy Paul, Vargas Pedro, Yuan Po, Chang Robert C: Mobile memory system for secure storage and delivery of media content. Sandisk, June 25, 2008: EP1934878-A2

The memory device contains control structures that allow media content to be stored securely and distributed in a manner envisioned by the content owner, or service providers involved in the distribution. A wide variety of different avenues become available for distributing media content using such ...

Deodatta Shenai-Khatkhate
Deodatta Vinayak Shenai Khatkhate, Egbert Woelk: Organometallic compounds. Rohm and Haas Electronic Materials, S Matthew Cairns, June 24, 2008: US07390360 (4 worldwide citation)

Compositions useful in the manufacture of compound semiconductors are provided. Methods of manufacturing compound semiconductors using these compositions are also provided.

Ravi Laxman
Ravi Laxman: Deposition of silicon germanium nitrogen precursors for strain engineering. Air Liquide Electronics Us, Air Liquide, Intellectual Property, June 19, 2008: US20080145978-A1

Methods for making a semiconductor device are disclosed herein. In general, the disclosed methods utilize compounds containing silicon, nitrogen, and germanium. Furthermore, the methods and compositions described are particularly applicable for formation of layers over gate structures or electrodes, ...

Jean-luc Dubois
Jean Luc Dubois, Christophe Duquenne, Wolfgang Holderich: Process For Dehydrating Glycerol To Acrolein. Arkema France, Arkema, Patent Department 26th Floor, June 19, 2008: US20080146852-A1

The present invention relates to a process for manufacturing acrolein by dehydration of glycerol in the presence of molecular oxygen. The reaction is performed in the liquid phase or in the gas phase in the presence of a solid catalyst. The addition of oxygen makes it possible to obtain good glycero ...

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