Elliot Matel Elliot Matel
Jeffrey P Feist, Elliot Matel, Matthew J Nagel: Exhaust deflector for a muffler. Briggs & Stratton Corporation, Michael Best & Friedrich, February 14, 2008: US20080035421-A1

An exhaust deflector is attachable to a muffler. The exhaust deflector includes a single-piece housing having a flange that defines an inlet aperture, an outlet wall that defines an outlet aperture, and an intermediate wall that interconnects the flange and the outlet wall. A mesh is in contact with ...


Craig Allen
Michael Chad Hollis, Craig Allen Carroll: Bevel Angle Locking Actuator and Bevel Angle Locking System for a Saw. Hunton & Williams, February 28, 2008: US20080047406-A1

A benchtop saw, such as a compound miter saw, has a bevel angle locking actuator for locking the bevel angle of the saw blade which is easier for the operator to reach than prior art bevel angle locking actuators that are located at the rear of the saw. The bevel angle locking actuator is mounted fo ...

Eric First, M.D.
Eric R First: Pressure Sore Treatment. Kirkpatrick & Lockhart Preston Gates Ellis, February 28, 2008: US20080050404-A1

Methods for treating a pressure sore or for preventing development of a pressure sore by local administration of a Clostridial toxin, such as a botulinum neurotoxin, to a pressure sore or to a pressure point, or to the vicinity thereof.

David Sherrer
Dan A Steinberg, David W Sherrer: Multi-level optical structure and method of manufacture. Shipley Company, Jonathan D Baskin, Rohm and Haas Electronic Materials, February 28, 2008: US20080050582-A1

A multi-level optical device includes a substrate having a baseline level. At least one feature is disposed at a level above the baseline level. At least one feature is disposed at a level below the baseline level, or in the feature above the baseline level is located at a distance apart from the fe ...

Charles Szmanda
Lujia Bu, Edward C Greer, Charles R Szmanda: Devices and methods for writing and reading information. Rohm And Haas Company, February 28, 2008: US20080049590-A1

Memory devices and methods of storing information are disclosed. Also disclosed are methods of storing information in multi-bit format and memory devices with information stored in multi-bit format. Further disclosed are methods of reading stored information.

Kevin Rodzinak
Armstrong Donna J, Hu Essa H, Kelly Michael J Iii, Layton Mark E, Li Yiwei, Liang Jun, Rodzinak Kevin J, Rossi Michael A, Sanderson Philip E, Wang Jiabing: Inhibitors of akt activity. Merck &Amp Amp Co, February 21, 2008: KR1020077028878

The instant invention provides for substituted naphthyridine compounds that inhibit Akt activity. In particular, the compounds disclosed selectively inhibit one or two of the Akt isoforms. The invention also provides for compositions comprising such inhibitory compounds and methods of inhibiting Akt ...

Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy: Heat sink for integrated circuit devices. International Business Machines Corporation, Greenblum & Bernstein, February 21, 2008: US20080042798-A1

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...

Ravi Laxman
John N Gregg, Scott L Battle, Jeffrey I Banton, Donn K Naito, Ravi K Laxman: Method and apparatus to help promote contact of gas with vaporized material. Advanced Technology Materials, Intellectual Property Technology Law, February 21, 2008: US20080041310-A1

Vaporizable material is supported within a vessel to promote contact of an introduced gas with the vaporizable material, and produce a product gas including vaporized material. A heating element supplies heat to a wall of the vessel to heat vaporizable mateiral disposed therein. The vessel may compr ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package. Tessera, Tessera, LERNER DAVID et al, February 21, 2008: US20080042249-A1

A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overlying the top surface of the lower unit substrate that are electrically connected to the conductive features o ...