11
Eric First, M.D.
Eric R First: toxin treatment for kinesia. Allergan, Claude L Nassif, Stephen Donovan, Martin A Voet, September 18, 2007: US07270287 (14 worldwide citation)

Methods for treating kinesia (motion sickness) by local administration of a Clostridial toxin, such as a botulinum toxin, to a cranial or neck area of a patient susceptible to motion sickness.


12
Erwin Meinders
Meinders Erwin R, Bouwmans Hinke S P: Master substratus and methods for mastering. Koninklijke Philips Electronics, September 17, 2007: KR1020077017864

The present invention relates to a master substrate (10) for creating a high-density relief structure, particularly a master substrate (10) for making a stamper for the mass fabrication of optical discs or a master substrate for creating a stamp for micro contact printing, wherein an organic dye lay ...


13

14

15
Ivo Koutsaroff 掘露 伊保龍
Ivoyl P Koutsaroff, Mark Vandermeulen, Andrew Cervin Lawry, Atin J Patel: Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same. Patent Group 2n, Jones Day, September 13, 2007: US20070209201-A1

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, ...


16
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Jae M Park, Belgacem Haba, Fion Tan, Philip R Osborn: Microelectronic connection components having bondable wires. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268304 (2 worldwide citation)

A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be f ...


17
David Sherrer
Dan A Steinberg, Mindaugas F Dautartas, David W Sherrer: Method of fabricating optical filters. Shipley Company L L C, Jonathan D Baskin, September 11, 2007: US07267781 (3 worldwide citation)

A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant opti ...


18
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Lee Smith, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck Gyu Kang: High-frequency chip packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268426 (34 worldwide citation)

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or comple ...


19
Robert Senzig
David M Hoffman, James LeBlanc, John Tkaczyk, Robert F Senzig, Yanfeng Du: Direct conversion energy discriminating ct detector with over-ranging correction. General Electric Company, Global Research, September 6, 2007: US20070206722-A1

A CT detector capable of energy discrimination and direct conversion is disclosed. The detector includes multiple layers of semiconductor material with the layers having varying thicknesses. The detector is constructed to be segmented in the x-ray penetration direction so as to optimize count rate p ...


20
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, September 6, 2007: US20070205496-A1

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...



Click the thumbnails below to visualize the patent trend.