21
Ravi Laxman
Ravi Laxman, Ashutosh Misra: Alkylsilanes As Solvents For Low Vapor Pressure Precursors. Air Liquide, June 14, 2007: US20070131252-A1

Compositions and methods for cleaning deposition systems utilizing alkylsilanes are described herein. In an embodiment, a method of cleaning a semiconductor fabrication system comprises flushing the system with a solvent comprising at least one alkylsilane. In another embodiment, a method of removin ...


22
Sandeep Tyagi
James Louis DeRudder, Raja Krishnamurthy, Rajashekhar Shiddappa Totad, Sandeep Tyagi, Robert Walter Venderbosch: Thermoplastic polycarbonate compositions with low gloss, articles made therefrom and method of manufacture. General Electric Company, Geam Cycoloy, June 14, 2007: US20070135589-A1

A thermoplastic composition comprising a polycarbonate, an impact modifier, an aromatic vinyl copolymer, and a polyorganosiloxane has excellent mechanical properties, in addition to suitable low gloss performance. An article may be formed by molding, extruding, shaping or forming such a composition ...


23
Sandeep Tyagi
Raja Krishnamurthy, Rajashekhar Shiddappa Totad, Sandeep Tyagi: Thermoplastic polycarbonate compositions with low gloss, articles made therefrom and method of manufacture. General Electric Company, Geam Cycoloy, June 14, 2007: US20070135570-A1

A thermoplastic composition comprising a polycarbonate, an impact modifier, an aromatic vinyl copolymer, and a functional copolymer has excellent mechanical properties, in addition to suitable low gloss performance. An article may be formed by molding, extruding, shaping or forming such a compositio ...


24
Erwin Meinders
Erwin Rinaldo Meinders, Andrei Mijiritskii, Hubert Cecile Francois Martens: Optical recording disc adapted to storing data using an ultra-violet laser source. Koninklijke Philips Electronics, Philips Intellectual Property & Standards, June 14, 2007: US20070133380-A1

Optical record carrier (20) adapted to storing data using a recording/reading device. The recording/reading device comprises an ultra-violet laser source emitting electromagnetic radiation (29) having a wavelength X in the range of 230 nm to 270 nm. The recording/reading device further comprises an ...


25
Erwin Meinders
Andrei Mijiritskii, Erwin Rinaldo Meinders: Label on laser entry side of an optical disc. Koninklijke Philips Electronics, Philips Intellectual Property & Standards, June 14, 2007: US20070133359-A1

An optical disc (3) for storing data is provided with a label material layer (8) on a laser entry side of the disc (3). The label material layer (8) does not impede reading data from or writing data onto the disc (3). Reflection or absorption of light in the visual spectrum by the label material in ...


26

27
Zhengxing Sun
Zhuang Zhengxing, Long Zanlun, Zheng Zhihong, Sun Weichen: Image sensor element and mfg. method. Lianhua Electronics, taofeng bei houyu, June 13, 2007: CN200510129706

First, the method forms photodiode and transistor on substrate, and forms a layer of self-aligned barrier of metal silicides on sensitization area of photodiode. Multiple times of procedures for connecting lines inside metal are carried out in order to form dielectric layers and connecting lines ins ...


28
Eric First, M.D.
Eric R First: Buttock deformity treatment. Allergan, Allergan, June 7, 2007: US20070128228-A1

Methods for treating a buttock deformity or for preventing development of a buttock deformity by local administration of a Clostridial toxin, such as a botulinum neurotoxin, to a buttock deformity or to the vicinity of a buttock deformity.


29
Nathaniel Brese
Jitendra S Goela, Nathaniel E Brese, Michael A Pickering: Semiconductor processing. Rohm and Haas Electronic Materials, John J Piskorski, Rohm and Haas Electronic Materials, June 7, 2007: US20070128837-A1

Methods are disclosed for providing reduced particle generating silicon carbide. The silicon carbide articles may be used as component parts in apparatus used to process semiconductor wafers. The reduced particle generation during semiconductor processing reduces contamination on semiconductor wafer ...


30
Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba: Stacked microelectronic packages. Tessera, Tessera, LERNER DAVID et al, June 7, 2007: US20070126102-A1

A microelectronic assembly including a first and second microelectronic elements. Each of the microelectronic elements have oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second ...