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Dr Raj C Thiagarajan ATOA Scientific Technologies Dr Raj C Thiagarajan ATOA Scientific Technologies
Chinniah Thiagarajan, Frans Adriaansen: Polymer roof panel solar energy conversion device. General Electric Company, Paul J DiConza, William E Powell III, June 26, 2007: US07234303 (4 worldwide citation)

A solar energy conversion device comprises a solar collector configured to collect solar energy. The solar collector comprises a plurality of roof panels. Each of the panels comprises at least one roof sheet comprising at least one wall, and further comprises a substantially transparent thermoplasti ...


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Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, Belgacem Haba, Giles Humpston: Compliant terminal mountings with vented spaces and methods. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070148824-A1

A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and terminals carried on the compliant structure adjacent the cavities and electrically connected to the wafe ...


3
Garo Khanarian
Garo Khanarian, Xiang Qian Liu, Angelo Pedicini: Siloxane encapsulants. Rohm And Haas Company, June 28, 2007: US20070148476-A1

Silicone-based polymers and polymeric compositions, methods of preparation of the silicone-based polymers and polymeric compositions, and methods of use thereof with high intensity applications are presented.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, IIyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145550-A1

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, David B Tuckerman: Microelectronic component with photo-imageable substrate. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070148941-A1

Methods for making a microelectronic component including a plurality of conductive posts extending and projecting away from a flexible substrate, wherein at least some of the conductive posts are electrically connected to a plurality of traces exposed on the flexible substrate.


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Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, Belgacem Haba, Giles Humpston: Compliant terminal mountings with vented spaces and methods. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145536-A1

A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070148822-A1

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell: Microelectronic assemblies having very fine pitch stacking. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070148819-A1

A microelectronic assembly includes two or more microelectronic packages stacked at a fine pitch, which is finer than the pitch that is possible when using solder balls for making the joint. Each stackable package desirably includes a substrate having pins projecting from one surface of the substrat ...


9
Erwin Meinders
Erwin Rinaldo Meinders, Andrei Mijiritskii: Multiple-spiral hybrid disc for e-book applications. Koninklijke Philips Electronics, Philips Intellectual Property & Standards, June 28, 2007: US20070147220-A1

The invention relates to an optical disc (10) comprising a hybrid information layer with at least two congruently adjoining spirals, whereby a first spiral (12) of said adjoining spirals comprises a ROM section containing read only data and a second spiral (14) of said adjoining spirals comprises a ...


10
Deodatta Shenai-Khatkhate
Shenai Khatkhate Deodatta Vina, Woelk Egbert: Organometallic composition. Rohm And Haas Electronic Mater, shayong sheng, June 27, 2007: CN200610167560

Compositions including germanium compounds suitable for use as vapor phase deposition precursors for germanium-containing films are provided. Methods of depositing films containing germanium using such compositions are also provided. Such germanium-containing films are particularly useful in the man ...



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